The trade-off between breakdown voltage (BV) stability and electrostatic discharge (ESD) robustness in n-channel laterally diffused metal-oxide-semiconductor (nLDMOS) devices was investigated, by utilizing computer-aided design (TCAD) simulations and charge-pumping (CP) measurements. The BV stability and ESD robustness were improved by enlarging the key parameter Lj of the drift region, and introducing the step-graded doping drift region, respectively. The proposed novel nLDMOS device demonstrates superior performance, exhibiting an excellent ESD robustness of 2.0 A and a minimal 2% BV degradation after 50,000 seconds of hot carrier injection (HCI) stress, representing a significant advancement in balancing ESD protection and long-term reliability.