2004 International Conferce on Test
DOI: 10.1109/test.2004.1386988
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An economic analysis and ROI model for nanometer test

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Cited by 21 publications
(11 citation statements)
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“…4(a). Given a set of test cubes T , we generate N s seeds for each test cube (lines [2][3][4][5][6]. N s is a user-defined parameter that restricts the search space of seeds.…”
Section: Seed Selectionmentioning
confidence: 99%
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“…4(a). Given a set of test cubes T , we generate N s seeds for each test cube (lines [2][3][4][5][6]. N s is a user-defined parameter that restricts the search space of seeds.…”
Section: Seed Selectionmentioning
confidence: 99%
“…As a result, the test-data volumes for today's integrated circuits are prohibitively high. For example, the test-data volume for transition-delay faults is two to five times higher than that for stuck-at faults [2], and test patterns for such sequence-and timing-dependent faults are more important for newer technologies [3]. Moreover, due to shrinking process technologies, the physical limits of photolithographic processing, and new materials such as copper interconnects, many new types of manufacturing defects cannot be accurately modeled using known fault models [4].…”
mentioning
confidence: 99%
“…For example, the test data volume for transition-delay faults is 2-5 times higher than that for stuck-at faults [20]. The 2005 ITRS document predicted that the test data volume and test application time for integrated circuits will be as much as thirty times larger in 2010 than they were in 2005 [1].…”
Section: Motivation and Prior Workmentioning
confidence: 99%
“…As a result, the test data volumes for today's integrated circuits are prohibitively high. For example, the test data volume for transition-delay faults is 2-5 times higher than that for stuckat faults [2], and test patterns for such sequence-and timingdependent faults are more important for newer technologies [3]. Moreover, due to shrinking process technologies, the physical limits of photolithographic processing, and new materials such as copper interconnects, many new types of manufacturing defects cannot be accurately modeled using known fault models [4].…”
Section: Introductionmentioning
confidence: 99%