An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration

Lorival, Jean-Etienne; Calmon, Françis; Sun, Fengyuan; Frantz, Felipe; Plossu, C.; Berre, M. Le; O’Connor, Ian; Valorge, Olivier; Charbonnier, Jean; Henry, David; Gontrand, Christian

doi:10.1016/j.mejo.2014.12.002

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An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration

Cited by 8 publications

References 15 publications

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