2015
DOI: 10.1088/0960-1317/25/11/115013
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An electrostatic vertical microscanner for phase modulating array-type Mirau microinterferometry

Abstract: HAL is a multidisciplinary open access archive for the deposit and dissemination of scientific research documents, whether they are published or not. The documents may come from teaching and research institutions in France or abroad, or from public or private research centers. L'archive ouverte pluridisciplinaire HAL, est destinée au dépôt et à la diffusion de documents scientifiques de niveau recherche, publiés ou non, émanant des établissements d'enseignement et de recherche français ou étrangers, des labora… Show more

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Cited by 10 publications
(10 citation statements)
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“…This is because of the vertical mechanical deformation of the suspended platform. Sasaki et al studied the impact of the error of the displacement amplitude on the sinusoidal modulation in interferometric applications [15]. This displacement of 70 nm is within the tolerances presented in the article.…”
Section: Dynamic Characterizationmentioning
confidence: 59%
See 1 more Smart Citation
“…This is because of the vertical mechanical deformation of the suspended platform. Sasaki et al studied the impact of the error of the displacement amplitude on the sinusoidal modulation in interferometric applications [15]. This displacement of 70 nm is within the tolerances presented in the article.…”
Section: Dynamic Characterizationmentioning
confidence: 59%
“…The construction of the microscanner is schematically presented in Figure 2a [15]. The device consists of 4x4 array of reference micromirrors (400 x 400 µm 2 ), which are integrated within silicon platform.…”
Section: Design and Simulation Of Vertical Microscannermentioning
confidence: 99%
“…The resonance frequency is found to be 485Hz. 12 Moreover, the reference mirrors wafer has to be compatible with the overall integration strategy based on anodic bonding (materials, process temperature, surface quality). Electrical interconnections are needed to drive the actuators by external electronics.…”
Section: Doublet Of Lensesmentioning
confidence: 99%
“…Indeed, by Deep Reactive Ion Etching (DRIE) technology, the silicon substrate and III-V compound semiconductors can be etched fairly quickly and manufactured at low cost for mass production 6,7 . This plasma technology is becoming increasingly attractive in a very wide set of applications [8][9][10][11] as well as for microfluidic devices [12][13][14] , microprobes 15 , microlens molds [16][17][18] , roll bearing components 19 and micro-optic structures 20 .…”
Section: Introductionmentioning
confidence: 99%