Fast ultra-deep silicon cavities: Toward isotropically etched spherical silicon molds using an ICP-DRIE

Herth, Étienne; Barański, Maciej; Berlharet, Djaffar; Edmond, Samson; Bouville, David; Calvet, Laurie E.; Gorecki, Christophe

doi:10.1116/1.5081503

Cited by 16 publications

(15 citation statements)

References 44 publications

(61 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Previously, we demonstrate that we can obtain fast ultradeep silicon cavities toward isotropically etched spherical silicon molds using an ICP‐DRIE . Our pseudo‐Bosch optimized dry etching process (at 50 mTorr, 2500 W, 0 °C) to manufacture the tall nanopillars with the slope profile of 90°.…”

Section: Discussionmentioning

confidence: 99%

Micro‐/Nanopillars for Micro‐ and Nanotechnologies Using Inductively Coupled Plasmas

Herth

Edmond

Bouville

et al. 2019

Physica Status Solidi (a)

Self Cite

View full text Add to dashboard Cite

Herein, the plasma etching mask transfer of the resistance of e‐beam resists, both negative and positive, as well as nanoparticle masks and hard masks are investigated. Various microscale and nanoscale features are exposed under plasma etching chemistries and are examined through both Bosch and pseudo‐Bosch processes using an inductive‐coupled plasma‐deep reactive ion etching (ICP‐DRIE) system. The selection of masks transfer proposed in this work provides better flexibility and cost‐effective processing. The etch profile depending on plasma etching process and feature size is studied and highlighted. In particular, nanopillars are etched to a length of 10 μm and a diameter of 280 nm with a good aspect ratio (>30) yielding a selectivity of better than 100:1 and a satisfactory vertical profile.

show abstract

Section: Discussionmentioning

confidence: 99%

Micro‐/Nanopillars for Micro‐ and Nanotechnologies Using Inductively Coupled Plasmas

Herth

Edmond

Bouville

et al. 2019

Physica Status Solidi (a)

Self Cite

View full text Add to dashboard Cite

show abstract

“…Standard micro-fabrication steps followed to obtain test samples are used. [16] The most used transfer masks for silicon etching are UV photoresists (PR), dielectrics, and metallic films. [24,41] Herein, we choose to use a PR mask, which is a low-cost approach.…”

Section: Methodsmentioning

confidence: 99%

“…[4][5][6][7][8] Researchers have actively worked on anisotropic etching chemistry, explaining the etching parameters' effect on the profile. [4,[9][10][11] Many dry etching techniques result in anisotropic etching profiles, [12] but some can produce isotropic silicon etching, such as techniques based on chemistries: xenon difluoride (XeF 2 ), [13,14] sulfur hexafluoride (SF 6 ) plasma, [15][16][17][18] and/or wet etching by using an aqueous solution [19,20] such as Hydrofluoric acid-nitric acid-acetic acid HNA composed of hydrogen fluoride (HF*), nitric acid (HNO 3 ), and acetic acid (CH 3 COOH). [21][22][23] The latter produces the smoothest spherical cavities than the XeF 2 or SF 6 .…”

Section: Introductionmentioning

confidence: 99%

“…[35] There are some publications where the isotropically etched spherical silicon moulds have analysed the profile cavity through a comparison between theory and experiments, using SF 6 with various additives at 13.56 MHz. [16,36,37] Besides, the isotropic characteristics of silicon moulds and the formation mechanisms in LF are not well known yet.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Screening of spherical moulds manufactured isotropically in plasma etching conditions

Herth

Belharet

Edmond

et al. 2021

Contributions to Plasma Physics

Self Cite

View full text Add to dashboard Cite

Micro-moulding is a critical rapid prototyping process chain used for a wide range of applications. This study demonstrates that it is possible to manufacture mould at low excitation frequency plasma (380 kHz), on a silicon substrate using fluorinated chemistry. According to the mask aperture designed and process time, the cavities profile characteristics, depending on the plasma chemistry, were analysed to predict the degree of anisotropy and the curvature. We show the possibility of creating curvature shapes with a desirable conic constant k of 1.25. In particular, we highlighted the smallest aperture sizes are more attractive for replicating optical micro-lens arrays using silicon moulds. Otherwise, the largest aperture sizes gain more attention for optoelectronics, microsystems, and microfluidics applications.

show abstract

“…The inductively coupled plasma (ICP) reactor has been thus widely used for anisotropic silicon etching because it is able to obtain a high aspect ratio while maintaining a vertical sidewall and by deep reactive ion etching (DRIE) technology, the silicon substrate can be etched faster. Recent works show the interest of using this microfabrication technique [15]. In our case, there is not a difficult Aspect Ratio AR=1.45, we use a standard Bosh process to obtain a straight profile.…”

Section: Drilled Imager Chipmentioning

confidence: 99%

A miniaturized optical sensor for particulate matter detection

Fournier

Barritault

Jobert

et al. 2020

Photonic Instrumentation Engineering VII

View full text Add to dashboard Cite

We present an innovative optical particulate matter sensor. This optical sensor 'on-a-chip' combines a visible fibered light source and a custom-made CMOS image sensor chip. By illuminating a single particle in an air channel, we can record the light scattering signature on the photodiode matrix. A piece realized in 3D printing achieves fiber alignment and an efficient stray light protection. A specific scattering pattern occurs from the interaction of light with a single particle. Unlike traditional optical PM sensors based on a single photodiode detection, we measure a lens-free projection of the scattering signature on the nearby image sensor (1.5mm projection distance). This allows us to count particles and determine their size and refractive index. These parameters are retrieved through image processing and by comparison with a radiometric model that calculates the projection of a Lorenz-Mie's scattering pattern. We describe the sensing technique, the architecture and fabrication of this sensor as well as the characterization results, which are in good agreement with our theory-based predictions. In particular, we show that it is possible to differentiate calibrated particulates of different sizes (monodisperse polystyrene-latex spheres). The sensor is sensitive enough to detect single particle and smallest than 1µm.

show abstract

Fast ultra-deep silicon cavities: Toward isotropically etched spherical silicon molds using an ICP-DRIE

Cited by 16 publications

References 44 publications

Micro‐/Nanopillars for Micro‐ and Nanotechnologies Using Inductively Coupled Plasmas

Micro‐/Nanopillars for Micro‐ and Nanotechnologies Using Inductively Coupled Plasmas

Screening of spherical moulds manufactured isotropically in plasma etching conditions

A miniaturized optical sensor for particulate matter detection

Contact Info

Product

Resources

About