2021
DOI: 10.1039/d0nr08997d
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An emission stable vertical air channel diode by a low-cost and IC compatible BOE etching process

Abstract: Nanoscale air/vacuum channel devices have shown great potential in extreme environments, high speed and low power consumption applications. Progress in fabrication, structure and material optimization keeps emerging. However, it remains...

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Cited by 18 publications
(10 citation statements)
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“…The electron affinity of GaN, in particular, can be reduced further by doping or altering the alloy component, with a minimum value of about 2.37 eV. [24] Besides, when a high electric field is applied, the strong polarization within the Vertical diode [19] Si BOE 80 1.08 1.16…”
Section: Electrical Performance and Operating Mechanisms Of The Gan Nacdmentioning
confidence: 99%
“…The electron affinity of GaN, in particular, can be reduced further by doping or altering the alloy component, with a minimum value of about 2.37 eV. [24] Besides, when a high electric field is applied, the strong polarization within the Vertical diode [19] Si BOE 80 1.08 1.16…”
Section: Electrical Performance and Operating Mechanisms Of The Gan Nacdmentioning
confidence: 99%
“…Generally, device structures are classified into planar or vertical types, depending on the difference in vacuum channel morphology [ 6 , 7 ]. In previous reports, no dielectric layer between the gate and channel in vertical-type NVCTs were included, so the electric field in the channel could be effectively modulated by the gate [ 7 , 8 , 9 , 10 , 11 ]. However, it also leads to the gate current leakage problem, which cannot be fundamentally solved.…”
Section: Introductionmentioning
confidence: 99%
“…Historically, vacuum tubes were the primary components used in electronics until being gradually replaced by solid-state electronics which have the advantages of integration, miniaturization, power efficiency, and low cost . Recently, the emergence of micro-/nanoscale manufacturing technologies has led to a resurgence of interest in vacuum electronics, resulting in the development of a novel device known as nanoscale air channel device (NACD). , The critical channel length of the NACD, achieved using technologies such as electron beam lithography (EBL), , focused ion beam (FIB) etching, , electro-forming, buffered oxide etch (BOE), , and so forth, is close to or less than the mean free path (MFP) (≈68 nm) of air at room temperature and pressure (RTP). This enables the electrons to be transported ballistically without scattering in the air channel.…”
Section: Introductionmentioning
confidence: 99%