An energy approach to quantification of adhesion strength from critical loads in scratch tests

Park, H.-S.; Kwon, Dongil

doi:10.1016/s0040-6090(97)00147-8

Cited by 34 publications

(22 citation statements)

References 17 publications

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“…Compared with the interfacial strength in ref. [13], there is rather high adhesion strength in this work. In addition, there is rather high measuring precision in the repeated scratch tests as shown in Table 1.…”

Section: Failure Model Analysis Of Cu Thin Film-substrate Structurementioning

confidence: 55%

An estimation method on failure stress of micro thickness Cu film-substrate structure

Wang

Meng

2009

Sci. China Ser. E-Technol. Sci.

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The failure of thin film-substrate structure occurs mainly at the thin film or the interface. However, the characterizing and estimating methods of failure stress in thin film are neither uniform nor effective because there are some complex effects of such as size, interface and stress state on the failure behavior of thin film-substrate structure. Based on the scanning electron microscope (SEM) in-situ investigation on the failure models of the Cu thin film-substrate structure and the nano scratched testing results, the failure stresses in different thicknesses of the Cu film-substrate were characterized, which were compared and confirmed by other methods, such as Stoney formula and other empiric equations. These results indicate that the novel estimating method of failure stress in thin film based on the critical wavelength of surface unstable analysis is better than other methods. The main reason is that the novel estimating method of failure stress in meso thickness film fully considered the effect factors of free surface unstable behavior and elastic anisotropy of thin film. Therefore, the novel estimating method of failure stress assists people to understand the critical interfacial strength and to set up the failure criterion of thin film-substrate structure.film-substrate structure, failure stress, interfacial strength, in-situ observation, nano scratch test

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Section: Failure Model Analysis Of Cu Thin Film-substrate Structurementioning

confidence: 55%

An estimation method on failure stress of micro thickness Cu film-substrate structure

Wang

Meng

2009

Sci. China Ser. E-Technol. Sci.

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“…The load corresponding to this damage provides a measure of scratch resistance or adhesive strength of a coating and is called the "critical load" (Park & Kwon, 1997). The definition of damage can be the onset of cracking around the scratching tip, spalling of the coating, or the formation of a channel in which all of the coating has been removed from the substrate.…”

Section: Nano-scratch Testmentioning

confidence: 99%

A Study of Adhesion of Silicon Dioxide on Polymeric Substrates for Optoelectronic Applications

Amendola¹,

Cammarano²,

Acierno³

2011

Optoelectronic Devices and Properties

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“…(ZHONGWEI et al 1998). The critical load measurement in scratch test have been used in assessing adhesion in film/substrate systems (PARK et al 1997).…”

Section: Palladium Thin Film Adhesionmentioning

confidence: 99%

“…The critical loads are strongly affected by various parameters such as scratching speed, indenture tip radius, film thickness (PARK et al 1997) The vertical force applied at the interface should have a maximum value in the local removing of the film for the horizontal motion of the point in which the load is applied. The vertical force is applied on a rounded point of sapphire characterised by a curvature radius r. This force produces a plastic deformation in GaAs substrate in a circle contact of radius a.…”

Section: Palladium Thin Film Adhesionmentioning

confidence: 99%

Chemical Deposited Pd on GaAs

Ghita

Nedelcu

Lazarescu

2002

Cryst. Res. Technol.

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An energy approach to quantification of adhesion strength from critical loads in scratch tests

Cited by 34 publications

References 17 publications

An estimation method on failure stress of micro thickness Cu film-substrate structure

An estimation method on failure stress of micro thickness Cu film-substrate structure

A Study of Adhesion of Silicon Dioxide on Polymeric Substrates for Optoelectronic Applications

Chemical Deposited Pd on GaAs

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