An Energy-Efficient Optically Connected Memory Module for Hybrid Packet- and Circuit-Switched Optical Networks

Brunina, Daniel; Liu, Dawei; Bergman, Keren

doi:10.1109/jstqe.2012.2224096

Cited by 29 publications

(16 citation statements)

References 19 publications

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“…If we use the above modulators in the two ends (the send and receive), there will be a complete wavelength mismatch when the temperature drifts by only 14°C (under such a temperature variation, wavelength drift is 1.54 nm > 1.48 nm). 3-D stacked nanophotonics, such as circuit-switched optical interconnection networks on logic, can not only decrease the memory access latency but also can improve the power efficiency [13]; however, the thermal crosstalk between the photonic components and high-power logic circuits presents a potential challenge for 3-D photonics.…”

Section: B Silicon Nanophotonicsmentioning

confidence: 99%

Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge

Zhang

Bakir

2014

IEEE Trans. Compon., Packag. Manufact. Technol.

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This paper summarizes the thermal challenges in conventional 3-D stacks and proposes a novel stacking structure that eases the thermal problem. The objective of this paper is first to define limits and opportunities for developing different 3-D chip stacks from a thermal perspective, and second to explore our proposed system as a function of microbumps, through silicon vias, die thickness, and other design parameters. In our proposed 3-D stack, the interposer integrated microfluidic heat sink serves as the main heat sink. To thermally decouple stacked dice, we propose air gap isolation between them and a thermal bridge on top of the stack to cool down the isolated die. To evaluate the thermal benefits of the stack, a thermal model is developed based on the finite difference method. Several chip stack scenarios are studied and the simulations are conducted with a processor power of 74.63 W/cm 2 and memory power of 2.82 W/cm 2 . The proposed architecture yielded processor and memory temperatures of 64°C and 40°C, respectively, compared with 76°C and 75°C for the air cooled stack. Index Terms-3-D integrated circuit (3-D IC), dynamic random-access memory (DRAM), microbumps, microfluidic heat sink (MFHS), multicore processor, through silicon vias (TSVs).

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Section: B Silicon Nanophotonicsmentioning

confidence: 99%

Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge

Zhang

Bakir

2014

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…The root cause of this problem [9] extends along two primary bottlenecks degrading the overall system performance: the long access time of both static and dynamic electronic Random Access Memories (SRAMs and DRAMs, respectively) and the limited bandwidth of the processor-main memory electrical bus. Towards addressing the limited bandwidth problem of electrical bus, optically interconnected CPU-memory paradigms have been demonstrated, indicating that future processor-main memory systems can leverage optics to increase bandwidth through data parallelism [11]- [13]. On the other hand, the long access times of electronic SRAM circuitry will still persist even though optical bus solutions come at the foreground.…”

Section: Introductionmentioning

confidence: 99%

III–V-on-Si Photonic Crystal Nanocavity Laser Technology for Optical Static Random Access Memories

Alexoudi

Fitsios

Bazin³

et al. 2016

IEEE J. Select. Topics Quantum Electron.

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“…In this effort, SOA-MZIs are expected to constitute key elements due to their proven credentials to offer a powerful generic building block for realizing key-processing functionalities for telecom applications, ranging from chipscale packet routing [2] and signal conditioning up to bitwise logic functions [3]. Similar routing and processing functionalities have already started to be exploited also in today's Manuscript rapidly rising field of optical interconnects [5], introducing an additional necessity to accelerate their integration into more compact structures of higher complexity. The first attempt for integrating multiple SOA-MZIs as generic processing blocks on a single chip was successful within the European Commission funded ICT-MUFINS project [2], where InP-based active components (SOAs) were combined with planar silica waveguides on a silicon board.…”

Section: Introductionmentioning

confidence: 99%

Dual SOA-MZI Wavelength Converters Based on III-V Hybrid Integration on a $\mu{\rm m}$-Scale Si Platform

Fitsios

Alexoudi

Kanellos

et al. 2014

IEEE Photon. Technol. Lett.

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We report on the simultaneous wavelength conversion operation of a dual-element semiconductor optical amplifier-Mach-Zehnder interferometer (SOA-MZI) array hybridly integrated on a 4-µm silicon-on-insulator (SOI) waveguide platform through thermocompression bonding. The SOAs are part of a six-element SOA array with both facets coupled on SOI through vertical and horizontal alignments. The device achieves almost two orders of magnitude reduction in footprint compared with state-of-the-art hybridly integrated SOA-MZI structures. We present for the first time experimental proof of the successful operation of a dual-element SOA-MZI device based on III-V technology on SoI that serves as a wavelength converter, with one SOA-MZI yielding error-free performance with a 0.8-dB power penalty at 12.5 Gb/s and the second SOA-MZI operating error-free at 10 Gb/s with a 2-dB power penalty.Index Terms-Mach-Zehnder interferometer, semiconductor optical amplifier, wavelength conversion, hybrid integration, thermocompression bonding, dual-facet coupling.

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An Energy-Efficient Optically Connected Memory Module for Hybrid Packet- and Circuit-Switched Optical Networks

Cited by 29 publications

References 19 publications

Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge

Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge

III–V-on-Si Photonic Crystal Nanocavity Laser Technology for Optical Static Random Access Memories

Dual SOA-MZI Wavelength Converters Based on III-V Hybrid Integration on a $\mu{\rm m}$-Scale Si Platform

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