An Evaluation of Quality of Joints of Two Dissimilar Metals by Diffusion Bonding using Ultrasonic C Scan

Kumar, S. Suresh; Ravisankar, B.

doi:10.1080/10426914.2015.1127957

Cited by 13 publications

(3 citation statements)

References 14 publications

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“…The liquidus temperature of the filler metal is lower than that of the faying surfaces; therefore, when the surfaces are heated they remain solid state whereas the filler metal will be in a liquidus state. Similar to diffusion bonding, diffusion brazing also relies on the diffusion of atoms as the liquidus filler metal interacts with the parent materials and diffuses to create the joint [ 11 , 12 ].…”

Section: Introductionmentioning

confidence: 99%

Powder Interlayer Bonding of Nickel-Based Superalloys with Dissimilar Chemistries

et al. 2021

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Novel joining methods are crucial for the aerospace industry to repair components damaged in the high stress, high cycle environment of the jet turbine engine. Powder interlayer bonding (PIB) is a novel joining technique that is being explored for use in the aerospace industry. PIB involves the use of a powder interlayer between two faying surfaces alongside a localised temperature gradient and compressive force to produce one joined workpiece. The use of a localised temperature gradient not only reduces the heat affected zone (HAZ) but also reduces the energy requirements for the process as only a small area of the component needs to be elevated in temperature. Nickel-based superalloys are commonly used in the gas turbine engine due to their superior mechanical properties that are maintained even under the most elevated temperatures experienced in the jet turbine engine. It is therefore essential these alloys can be easily repaired. Conventional joining methods such as friction welding have proved difficult for new generation nickel-based superalloys; therefore, there is much interest in PIB as an alternative repair technology. This study shows the potential of PIB to join dissimilar nickel-based superalloys: bonds with very little porosity were observed after only a short processing time.

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Section: Introductionmentioning

confidence: 99%

Powder Interlayer Bonding of Nickel-Based Superalloys with Dissimilar Chemistries

et al. 2021

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“…The dissimilar metal joining of aluminium and copper is required in electronic packaging applications, such as joining heatsink into the integrated chip packages [1]. However, the conventional joining of aluminium and copper always employs the methods of friction stir welding [2], brazing [3] and vacuum diffusion bonding [4]. These methods are generally operated at a high reaction temperature above 550°C in a vacuum or at high pressure, which cause severe damage to electronic components.…”

Section: Introductionmentioning

confidence: 99%

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

Ren

Huang

2021

Science and Technology of Welding and Joining

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The effects of ultrasonic-assisted soldering parameters on the interfacial microstructural evolution and shear strength of designed Al/Sn-9.77Zn-11.36Bi-1.46Ag/Cu solder joints were investigated. The ultrasonic-assisted soldering process promoted the dissolution of Al substrate and roughed Al/solder interface, which improved the pinning effect of Sn-9.77Zn-11.36Bi-1.46Ag on Al substrate. With an increasing ultrasonic soldering temperature, time and power, more Al atoms dissolved from Al substrate and migrated across solder to the opposite Cu substrate to form Al-rich (Zn) solid solutions. Consequently, Al 4.2 Cu 3.2 Zn 0.7 formed between -AgZn 3 and Cu 5 Zn 8 layers at Cu substrate, resulting in thinner Cu 5 Zn 8 and higher shear strength of solder joints. The highest shear strength of solder joints (38.6 MPa) was achieved after ultrasonicassisted soldering at 300°C for 10 s under 9 W.

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“…Luan et al [22] used the time-scale amplitude and a characteristics extraction algorithm to evaluate bonded and unbonded conditions. Suresh et al [23] and Suresh et al [24] assessed the quality of diffusion bonded joints using an ultrasonic "C" scanning technique, and reported that the mechanical properties of the joint can be effectively characterized.…”

Section: Introductionmentioning

confidence: 99%

Study of a Bimetallic Interfacial Bonding Process Based on Ultrasonic Quantitative Evaluation

Zhang

Liu

et al. 2018

Metals

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The interfacial bonding process and mechanical properties of AISI (American Iron and Steel Institute) stainless steel/Q235A carbon steel were investigated by deformation bonding, heat preservation, and tensile tests. The results reveal that the deformation temperature has a beneficial effect on the bonding rate, and that the critical temperature for the large-area bonding of stainless steel and carbon steel is approximately 700 • C. However, owing to the short contact time, only a shallow diffusion of approximately 2-3 µm can be achieved. A slight decrease in the interfacial bonding rate after heat preservation is correlated to the difference between the thermal expansion coefficients of the two materials, but the thickness of the diffusion layer shows a significant increase. It was found that the strength of the composites is mostly related to the bonding rate and the strength of the relatively soft material, which can be determined using an explicit equation. Moreover, with the increase in the interfacial bonding rate, the crack source changes from the junction of the unbonded and bonded areas of the interface to the interior of the carbon steel. The failure mode evolves from cleavage brittle fracture to ductile-brittle mixed-mode fracture, and then to ductile fracture.

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An Evaluation of Quality of Joints of Two Dissimilar Metals by Diffusion Bonding using Ultrasonic C Scan

Cited by 13 publications

References 14 publications

Powder Interlayer Bonding of Nickel-Based Superalloys with Dissimilar Chemistries

Powder Interlayer Bonding of Nickel-Based Superalloys with Dissimilar Chemistries

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

Study of a Bimetallic Interfacial Bonding Process Based on Ultrasonic Quantitative Evaluation

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