2012 IEEE International Test Conference 2012
DOI: 10.1109/test.2012.6401595
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An experiment of burn-in time reduction based on parametric test analysis

Abstract: Burn-in is a common test approach to screen out unreliable parts. The cost of burn-in can be significant due to long burn-in periods and expensive equipment. This work studies the potential of using parametric test data to reduce the time of burn-in. The experiment focuses on developing parametric test models based on test data collected after 10 hours of burn-in to predict parts likely-to-fail after 24 and 48 hours of burn-in. Our study shows that 24-hour and 48-hour burn-in failures behave abnormally in mult… Show more

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Cited by 34 publications
(12 citation statements)
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“…The stress conditions usually applied during burn-in (high temperature and voltage) induce a significant NBTI degradation (V th increase) [7], [16]. The method to determine the ST V th for the proposed design approach can be qualitatively explained through (break-even point) at the end of the burn-in test (at t BI = t BE in Fig.…”
Section: Proposed Approach For St Designmentioning
confidence: 99%
See 1 more Smart Citation
“…The stress conditions usually applied during burn-in (high temperature and voltage) induce a significant NBTI degradation (V th increase) [7], [16]. The method to determine the ST V th for the proposed design approach can be qualitatively explained through (break-even point) at the end of the burn-in test (at t BI = t BE in Fig.…”
Section: Proposed Approach For St Designmentioning
confidence: 99%
“…This effect increases dramatically at higher operating temperature and supply voltage [7]. These conditions are typically experienced by ICs during standard burn-in test [16], which can cause significant NBTI degradation (V th increase) of the devices even for short burn-in duration (tens of hours) [7].…”
Section: Introductionmentioning
confidence: 99%
“…NBTI aging is exacerbated by high operating temperature and supply voltage. In the IC manufacturing flow, these conditions are experienced during burn-in test, which aims at stressing circuits under test in order to identify those likely to fail early in their life cycle [10]. Therefore, standard burn-in test can cause a significant NBTI degradation even for short burn-in duration [11].…”
Section: Introductionmentioning
confidence: 99%
“…The Cypress SRAM requires more SRAM cells than ISSI SRAM because they produce more erroneous responses. One of the major [46][47][48]. We need at least a single measurement to register CRP (both for weak and strong PUF) in a database.…”
Section: Reliability Comparisonmentioning
confidence: 99%