An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays

Harris, Daniel K.; Palkar, Ashish; Wonacott, G D; Dean, Robert N.; Simionescu, F.

doi:10.1115/1.4001745

Cited by 13 publications

(5 citation statements)

References 16 publications

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“…Thus, improved measurement reproducibility will save companies in the electronics industry, which frequently tests TIMs, time and money. As a compounding factor, the advent of new materials has introduced a class of high-performance TIMs [1][2][3][4][5] that are difficult to characterize properly because they have thermal resistances lower than the uncertainty floor of commercially available measurement tools. Research to improve these characterization tools is critical in order for high-performance TIMs to be successfully introduced into the market.…”

Section: Introductionmentioning

confidence: 99%

A Stepped-Bar Apparatus for Thermal Resistance Measurements

Thompson¹,

Rao

Cola

2013

Journal of Electronic Packaging

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A stepped-bar apparatus has been designed and constructed to characterize the thermal resistance of materials using steady-state heat transfer techniques. The design of the apparatus is a modification of the ASTM D5470 standard where reference bars of equal cross-sectional area are used to extrapolate surface temperatures and heat flux across a sample of unknown thermal resistance. The design modification involves intentionally oversizing the upper reference bar (URB) of the apparatus to avoid contact area uncertainty due to reference bar misalignment, which is difficult to account for, as well as the high cost that can be associated with equipping the apparatus with precise alignment controls (e.g., pneumatic alignment). Multidimensional heat transfer in the upper reference bar near the sample interface is anticipated using numerical modeling. The resulting nonlinear temperature profile in the upper reference bar is accounted for by fitting a second order regression line through thermocouple readings near the sample interface. The thermal resistances of commercially available thermal gap pads and thermal pastes were measured with the stepped-bar apparatus; the measured values were in good agreement with published results, and exhibited a high degree of reproducibility. The measurement uncertainty of both the standard and stepped-bar apparatus decrease with increased thermocouple precision. Notably, the uncertainty due to reference bar misalignment with the standard apparatus becomes more pronounced as thermocouple precision and the number of thermocouples increases, which suggests that the stepped-bar apparatus would be especially advantageous for enabling accurate, high-precision measurements of very low thermal resistances.

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Section: Introductionmentioning

confidence: 99%

A Stepped-Bar Apparatus for Thermal Resistance Measurements

Thompson¹,

Rao

Cola

2013

Journal of Electronic Packaging

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“…The novel MHPs demonstrate 10.6 times higher in the maximum equivalent thermal conductivity than that of the pure silicon wafer. In order to comprehensively understand the thermal performance of MHPs, micro-temperature sensors including poly-silicon integrated thermistors [36,[41][42][43][44] and platinum resistance temperature detectors (RTDs) [45] were used to obtain temperature profile along the longitudinal axis of a MHP array precisely.…”

Section: Experimental Investigationmentioning

confidence: 99%

MEMS-Based Micro-heat Pipes

Qu¹,

Wang²

2016

Electronics Cooling

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Micro-electro-mechanical systems (MEMS)-based micro-heat pipes, as a novel heat pipe technology, is considered as one of the most promising options for thermal control applications in microelectronic circuits packaging, concentrated solar cells, infrared detectors, micro-fuel cells, etc. The operating principles, heat transfer characteristics, and fabrication process of MEMS-based micro-grooved heat pipes are firstly introduced and the state-of-the-art of research both experimental and theoretical is thoroughly reviewed. Then, other emerging MEMS-based micro-heat pipes, such as micro-capillary pumped loop, micro-loop heat pipe, micro-oscillating heat pipe, and micro-vapor chamber are briefly reviewed as well. Finally, some promising and innovatory applications of the MEMS-based micro-heat pipes are reported. This chapter is expected to provide basic reference for future researches.

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“…Especially, heat pipes with rectangular grooved wicks are an essential part of the thermal management in space applications since they enable the transportation of liquid in long distances due not only to their higher permeability compared to their sintered counterparts [3,4,5] but also their ease of manufacture [6,7,8]. Moreover, utilization of embedded micro-grooves is much more feasible compared to the wicks with sintered grains and wire meshes passive in the chip-level electronic cooling applications [9,10,11].…”

Section: Introductionmentioning

confidence: 99%

On the effect of structural forces on a condensing film profile near a fin-groove corner

Akdag,

Akkus,

Dursunkaya

2020

Preprint

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Estimation of condenser performance of two-phase passive heat spreaders with grooved wick structures is crucial in the prediction of the overall performance of the heat spreader.Whilst the evaporation problem in micro-grooves has been widely studied, studies focusing on the condensation on fin-groove systems have been scarce. Condensation on fin-groove systems is actually a multi-scale problem. Thickness of the film near the fin-groove corner can decrease to nanoscale dimensions, which requires the inclusion of nanoscale effects into the modeling. While a few previous studies investigated the effect of dispersion forces, the effect of structural forces has never been considered in the thin film condensation modeling on fin-groove systems. The present study utilizes a disjoining pressure model which considers both dispersion and structural forces. The results reveal that structural forces are able to dominate dispersion forces in certain configurations. Consequently, by intensifying the disjoining pressure, structural forces lead to a sudden change of the film profile (slope break) for subcooling values which are relevant to engineering applications.

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An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays

Cited by 13 publications

References 16 publications

A Stepped-Bar Apparatus for Thermal Resistance Measurements

A Stepped-Bar Apparatus for Thermal Resistance Measurements

MEMS-Based Micro-heat Pipes

On the effect of structural forces on a condensing film profile near a fin-groove corner

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