2010
DOI: 10.1007/s00170-010-2991-x
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An experimental study of ultrasonic vibration-assisted grinding of polysilicon using two-dimensional vertical workpiece vibration

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Cited by 40 publications
(8 citation statements)
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“…Each abrasive grit in ultrasonic vibration-assisted all conducts an elliptic-vibration cutting action and the intermittent engagement of the tool and work-piece is achieved, which results in the chip formation and tool-chip friction variation [10]. Furthermore, the elliptic ultrasonic vibration may introduce an additional acceleration to the cutting grits [11] and cause the high pressure phase transition of A356 Thus, the removal mechanism is changed.…”
Section: Discussionmentioning
confidence: 99%
“…Each abrasive grit in ultrasonic vibration-assisted all conducts an elliptic-vibration cutting action and the intermittent engagement of the tool and work-piece is achieved, which results in the chip formation and tool-chip friction variation [10]. Furthermore, the elliptic ultrasonic vibration may introduce an additional acceleration to the cutting grits [11] and cause the high pressure phase transition of A356 Thus, the removal mechanism is changed.…”
Section: Discussionmentioning
confidence: 99%
“…This method makes good processing accuracy but only can be used in processing a through hole. Ultrasonic assisted grinding technology was carried out by Peng et al [4][5][6]. Their experiments show good performance on obtaining high quality surface.…”
Section: Figure 1 Components and Operating Principle Of Dtgmentioning
confidence: 99%
“…Większość publikacji literaturowych dotyczących szlifowania wibracyjnego powierzchni płaskich obejmuje drgania wymuszone w zakresie częstotliwości ultradźwiękowych [6], [7], [9], [10], [11]. Natomiast pozycje literaturowe ze stosowanymi niskimi częstotliwościami -do 1kHz są nieliczne [3], [8], [12] i również wykazują pozytywne zalety prowadzenia tego procesu.…”
Section: Abstract: Modelling Vibratory Grindingunclassified