An experimental study on an electro-osmotic flow-based silicon heat spreader

Eng, P. F.; Nithiarasu, Perumal; Guy, Owen J.

doi:10.1007/s10404-010-0594-3

Cited by 18 publications

(6 citation statements)

References 25 publications

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“…The proposed micropump design has many advantages over the conventional micropumps used in microscale heat exchangers. In previous designs [10][11][12][13][14][15], the microchannels were etched on a silicon substrate and the microchannels were usually sealed using a glass cover. Such fabrication using silicon is complicated and time consuming as the etching process often causes rough and irregular microchannel walls.…”

Section: Experimental Methodsmentioning

confidence: 99%

“…Management Applications. Most of the EOF micropumps used for the thermal management of microelectronic devices are silicon based [10][11][12][13][14][15]. While silicon has high thermal conductivity and its machining techniques are well established, its fabrication can be time consuming and includes multistep processes.…”

Section: Improved Design Of Microchannels For Thermalmentioning

confidence: 99%

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Improved Flow Rate in Electro-Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles

Al-Rjoub

Roy

Ganguli

et al. 2015

Journal of Electronic Packaging

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A new design for an electro-osmotic flow (EOF) driven micropump was fabricated. Considering thermal management applications, three different types of micropumps were tested using multiple liquids. The micropumps were fabricated from a combination of materials, which included: silicon-polydimethylsiloxane (Si-PDMS), Glass-PDMS, or PDMS-PDMS. The flow rates of the micropumps were experimentally and numerically assessed. Different combinations of materials and liquids resulted in variable values of zeta-potential. The ranges of zeta-potential for Si-PDMS, Glass-PDMS, and PDMS-PDMS were −42.5–−50.7 mV, −76.0–−88.2 mV, and −76.0–−103.0 mV, respectively. The flow rates of the micropumps were proportional to their zeta-potential values. In particular, flow rate values were found to be linearly proportional to the applied voltages below 500 V. A maximum flow rate of 75.9 μL/min was achieved for the Glass-PDMS micropump at 1 kV. At higher voltages nonlinearity and reduction in flow rate occurred due to Joule heating and the axial electro-osmotic current leakage through the silicon substrate. The fabricated micropumps could deliver flow rates, which were orders of magnitude higher compared to the previously reported values for similar size micropumps. It is expected that such an increase in flow rate, particularly in the case of the Si-PDMS micropump, would lead to enhanced heat transfer for microchip cooling applications as well as for applications involving micrototal analysis systems (μTAS).

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Section: Experimental Methodsmentioning

confidence: 99%

Section: Improved Design Of Microchannels For Thermalmentioning

confidence: 99%

Improved Flow Rate in Electro-Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles

Al-Rjoub

Roy

Ganguli

et al. 2015

Journal of Electronic Packaging

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“…Among microfluidic actuators, micropumps are one of the essential active components in μ TAS, which have been developed by CMOS integration. Particularly, electroosmotic flow (EOF) micropumps are widely used in many applications [19]- [21] ranging from μ TAS systems [22]- [24] to cooling of integrated circuits [25], [26] because of their simple structure.…”

Section: Introductionmentioning

confidence: 99%

“…Owing to the simple structure, the integration of sensors with EOF micropumps [27]- [29] and CMOS-compatible EOF micropumps have been investigated [26], [28]. However, the driving circuits of EOF micropumps have not been integrated or miniaturized yet.…”

Section: Introductionmentioning

confidence: 99%

On-Chip CMOS-MEMS-Based Electroosmotic Flow Micropump Integrated With High-Voltage Generator

Okamoto

Ryoson

Fujimoto

et al. 2020

J. Microelectromech. Syst.

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The rapid development of microfluidic technology has increased the demand for the integration of driving circuits in the microfluidic devices. We have proposed a novel on-chip electroosmotic (EOF) micropump integrated with a high-voltage (HV) generator. The HV (49.8 V) generator is based on a Dickson charge pump, which is fabricated on a silicon-on-insulator (SOI) substrate by the standard CMOS process, and the isolation is achieved by MEMS post-processed deep trench isolation. The size of the 49.8 V generator is 425×353 µ m 2 . The HV required for the successful operation of the micropump was generated by the integrated driving circuit with a low-voltage power supply. The maximum flow velocity and flow rate of the proposed EOF micropump were measured as 137 µ m/s and 167 nL/min, respectively when it was driven by the integrated 49.8 V generator. The efficiency of the micropump is demonstrated by comparing it with the previously reported micropumps. The proposed integration technique is reliable and effective, and potentially boosts the practical applications of lab-on-chip devices.

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“…Ultimately, in drug delivery application, a continuous supply of a therapeutic drug would be required. The microneedle arrays would thus need to be integrated with a microfluidic pump, such as a voltage controlled pump developed previously [11].…”

Section: Introductionmentioning

confidence: 99%

Advanced deep reactive‐ion etching technology for hollow microneedles for transdermal blood sampling and drug delivery

Liu

Eng

Guy

et al. 2013

IET nanobiotechnol.

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Using an SPTS Technologies Ltd. Pegasus deep reactive-ion etching (DRIE) system, an advanced two-step etching process has been developed for hollow microneedles in applications of transdermal blood sampling and drug delivery. Because of the different etching requirements of both narrow deep hollow and large open cavity, hollow etch and cavity etch steps have been achieved separately. This novel two-step etching process is assisted with a bi-layer etching mask. Results show that the etch rate of silicon during this hollow etch step was about 7.5 microm/min and the etch rate of silicon during this cavity etch step was about 8-10 microm/min, using the coil plasma etching power between 2.0 and 2.8 kW. Especially for the microneedle bores etch, the deeper it etched, the slower the etch rate was. The microneedle bores have successfully been obtained 75-150 microm in inner diametre and 700-1000 microm long with high aspect ratio DRIE, meanwhile, the vertical sidewall structures have been achieved with the high etch load exposed area over 70% for the cavity etch step.

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An experimental study on an electro-osmotic flow-based silicon heat spreader

Cited by 18 publications

References 25 publications

Improved Flow Rate in Electro-Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles

Improved Flow Rate in Electro-Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles

On-Chip CMOS-MEMS-Based Electroosmotic Flow Micropump Integrated With High-Voltage Generator

Advanced deep reactive‐ion etching technology for hollow microneedles for transdermal blood sampling and drug delivery

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