An implementation study on a heat sink with different fin configurations under natural convective conditions

Hussein, Maha A.; Hameed, Vinous M.; Dhaiban, Hussein T.

doi:10.1016/j.csite.2022.101774

Cited by 13 publications

(3 citation statements)

References 22 publications

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“…Microchannel heat sinks having non-circular cross sections, especially rectangular microchannel heatsinks, have been widely explored (Jia et al, 2018;Kose et al, 2022). Different researchers have used different approaches, such as experimental (Peng et al, 1994), numerical (Choquette et al, 1996), and analytical (Zhimin and Fah, 1997), as well as models such as fin (Zhao and Lu, 2002;Hussein et al, 2022) porous medium (Kim, 2004), and thermal resistance (Liu and Garimella, 2005), to analyze and optimize the geometrical parameter combinations that have resulted in the best performance for microchannel heatsinks. To increase the heat removal capacities of microchannel heatsinks, different coolants, materials, flow conditions, and microchannel geometries were explored.…”

Section: Microchannel Heat Sinks and Coolant Typesmentioning

confidence: 99%

RETRACTED: Study of thermal characteristics of energy efficient micro channel heat sinks in advanced geometry structures and configurations: A review

et al. 2022

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The sustainability and economic development is intertwined with the energy consumption and conversion processes. To suffice the ever-increasing demand of energy consumption amid environmental concerns, energy conservation and recovery along with the harnessing of renewable energy has been mandated by the policy regulators. In any energy conversion process, heat exchangers are vital operation component and has been part of any energy conversion process since the Nineteenth century. However, due to the increased energy demand, requirement of high efficiency and space and material constraints, the need for miniaturized light-weight heat exchangers with adequate heat transfer characteristics persists. Traditional heat exchangers are outdated because of its large space requirements and comparatively less heat removal rate. The miniaturized micro channel heat sink (MCHS) with tubes of about less than 1 mm have a tremendous potential to further enhance the heat transfer performance. However, its simple design doesn’t cope with the modern requirements of heat removal. Therefore, many researchers have tried to improve its performance using different techniques. The present study reviews some of the most important techniques applied to MCHS. These techniques include, coolant types used in MCHS, MCHS shapes, flow conditions, numerical methods used for this research, and materials used to manufacture MCHS. Moreover, some recommendations have been given to provide opportunities to researchers for future aspects.

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Section: Microchannel Heat Sinks and Coolant Typesmentioning

confidence: 99%

RETRACTED: Study of thermal characteristics of energy efficient micro channel heat sinks in advanced geometry structures and configurations: A review

et al. 2022

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“…Consequently, the heat sink with arcuate fins demonstrated the highest values of the performance evaluation criteria (PEC). According to the results of a number of studies, the geometry of the fin has a significant impact on the thermal and hydraulic characteristics of the heat sink [28]. As evidenced by the results of the study [29], changing the geometry of the fins-for example, their corrugation-can result in a sharp increase in the pressure drop.…”

Section: Introductionmentioning

confidence: 99%

Numerical Study of the Thermal and Hydraulic Characteristics of Plate-Fin Heat Sinks

Soloveva,

Solovev,

Shakurova

2024

Processes

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One of the main trends in the development of the modern electronics industry is the miniaturization of electronic devices and components. Miniature electronic devices require compact cooling systems that can dissipate large amounts of heat in a small space. Researchers are exploring ways to improve the design of the heat sink of the cooling system in such a way that it increases the heat flow while at the same time reducing the size of the heat sink. Researchers have previously proposed different designs for heat sinks with altered fin shapes, perforations, and configurations. However, this approach to optimizing the design of the heat sink results in an increase in the labor intensity of its production. Our goal is to optimize the heat sink design to reduce its size, reduce metal consumption, and increase heat flow. This goal is achieved by changing the number of fins and the distance between them. In this case, there is no significant difference in the geometry of a conventional plate-fin heat sink, and a low labor intensity of production is ensured. A numerical investigation of heat flow and pressure drop in models of plate-fin heat sinks of various sizes and metal volumes was conducted using the ANSYS Fluent software package (v. 19.2) and computational fluid dynamics employing the control volume method. We used the SST k-ω turbulence model for the calculations. The research results showed that by changing the number of fins and the distance between them, it is possible to increase the heat flow from the heat sink to 24.44%, reduce its metal consumption to 6.95%, and reduce its size to 30%. The results of this study may be useful to manufacturers of cooling systems who seek to achieve a balance between the compactness of the heat sink and its ability to remove large amounts of heat.

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“…The goal in developing a system that includes power components is therefore to keep the temperature gradient of the components as evenly distributed as possible. This can be done by mechanically modifying the heat sink [10]- [12] or by so-called active thermal control [13], [14]. The latter requires the use of sensors and control technology to measure the temperature of the semiconductor component and to regulate the control of the fan as well as the control of the component.…”

Section: Introductionmentioning

confidence: 99%

A Test Rig for Thermal Analysis of Heat Sinks for Power Electronic Applications

Sharp,

Monir,

Day

et al. 2023

2023 IEEE East-West Design &Amp; Test Symposium (EWDTS)

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This paper discusses the design and manufacture of a test rig for practical thermal analysis of the temperature distribution across forced air-cooled heat sinks. Hightemperature gradients across power electronic modules that have a large area of semiconductor structure can result in premature failure of the components due to mechanical stressrelated fatigue. Computer modelling and simulations predict the temperature distribution across the heat sink, but physical temperature measurements are required to validate these results. In order to acquire these temperature readings, a bespoke test rig is designed and manufactured. Temperature readings obtained using this test rig are applied for comparison to those obtained by computer simulation and, hence provide validation of the computer simulation results.

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An implementation study on a heat sink with different fin configurations under natural convective conditions

Cited by 13 publications

References 22 publications

RETRACTED: Study of thermal characteristics of energy efficient micro channel heat sinks in advanced geometry structures and configurations: A review

RETRACTED: Study of thermal characteristics of energy efficient micro channel heat sinks in advanced geometry structures and configurations: A review

Numerical Study of the Thermal and Hydraulic Characteristics of Plate-Fin Heat Sinks

A Test Rig for Thermal Analysis of Heat Sinks for Power Electronic Applications

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