An In-line Failure Analysis System Based on IR Thermography Ready for Production Line Integration

Wargulski, Dan R.; May, Daniel; Loffler, Florian; Nowak, Torsten; Petrick, Jan; Grosse, Corinna; Wunderle, Bernhard; Boschman, E.; Ras, Mohamad Abo

doi:10.1109/therminic.2019.8923598

Cited by 8 publications

(1 citation statement)

References 3 publications

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“…This boosts the thermal signal which is detectable by the IR camera. Especially in cases of silicon dies or metallization, by coating the signal increases by a multiple and many defects are therefore not detectable without coating [5][6][7].…”

Section: Figure 1: Principle and Setup Of A Pulsed Infrared Thermography Measurement On A Sintered Diementioning

confidence: 99%

Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation

Wargulski¹,

May²,

Grosse-Kockert³

et al. 2020

Proceedings of the 2020 International Conference on Quantitative InfraRed Thermography

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In this study we demonstrate the capabilities of the IR thermography for the inspection of silver-sinter die attaches. Sintered specimens such as 15 x 15 mm² dummy dies sintered on AMB substrates have been measured by pulsed infrared thermography (PIRT), lock-in infrared thermography (LIT) and as a reference by scanning acoustic microscopy. PIRT and LIT will be compared with the focus on the applicability in production lines. Both methods usually need a sample surface blackening which will be avoided here. This need of a sample preparation by blackening or other coating for sample surfaces with low emissivity and absorptivity is one of the main reasons for the low technology adoption of thermography methods for the inspection of thermal interfaces in electronics in industry.

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Section: Figure 1: Principle and Setup Of A Pulsed Infrared Thermography Measurement On A Sintered Diementioning

confidence: 99%

Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation

Wargulski¹,

May²,

Grosse-Kockert³

et al. 2020

Proceedings of the 2020 International Conference on Quantitative InfraRed Thermography

View full text Add to dashboard Cite

show abstract

Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings

Wargulski

May

Boschman³

et al. 2020

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

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Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics

Schaal

Klingler

Metais

et al. 2020

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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An In-line Failure Analysis System Based on IR Thermography Ready for Production Line Integration

Cited by 8 publications

References 3 publications

Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation

Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation

Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings

Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics

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