2018
DOI: 10.1002/slct.201601921
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An Innovative Light Trapping Structure Fabrication Method on Diamond‐Wire‐Sawing Multi‐Crystalline Silicon Wafers

Abstract: An innovative fabrication method of light trapping structures on the surface of diamond‐wire‐sawing multi‐crystalline silicon (DWS mc‐Si) is proposed, which may trigger new progress in photovoltaic (PV) industry. A simple pre‐etching step with HNO3/HF solution is used to remove the saw marks of the wafers as well as amorphous silicon layers, and form vermicular micro‐hollows. Then, the HNO3/HF fog formed by ultrasonic vibration etches the silicon surface to fabricate nano‐scale porous structures on the above m… Show more

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