An innovative micro optical element assembly robot characterized by high accuracy and flexibility

Würsch, A.; Scussat, M.; Clavel, Reymond; Salathé, René-Paul

doi:10.1109/ectc.2000.853152

Cited by 7 publications

(4 citation statements)

References 2 publications

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“…The holder attachment to the mounting plate can be perform in a one laser reflow step procedure. The laser shot typical duration is 2 s. The assembly robot called ''SIXTIFF'' including a special mechanical gripper have been developed for the TRIMO application [3]. The robot linear resolution in x, y (horizontal) and z (vertical) is 0.25 mm and the angular resolution is 1 mrad in y x and y y and 17 mrad in y z : The working volume is 100 Â 100 Â 50 mm 3 .…”

Section: Active Alignmentmentioning

confidence: 99%

A surface-mounted device assembly technique for small optics based on laser reflow soldering

Stauffer¹,

Würsch²,

Gächter³

et al. 2005

Optics and Lasers in Engineering

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Section: Active Alignmentmentioning

confidence: 99%

A surface-mounted device assembly technique for small optics based on laser reflow soldering

Stauffer¹,

Würsch²,

Gächter³

et al. 2005

Optics and Lasers in Engineering

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“…17 This device can reliably achieve six-degree-of-freedom repeatability to around 300 nm. A 6-DoF research effort also claims precision to below 500 nm, 18 but their published claims are difficult to scrutinize.…”

Section: Micro/macro Gripper Designmentioning

confidence: 99%

Micro/macro force-servoed gripper for precision photonics assembly and analysis

Voyles

Hulst

2005

Robotica

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Link to this article: http://journals.cambridge.org/abstract_S0263574704000839How to cite this article: Richard M. Voyles and Seth Hulst (2005). Micro/macro force-servoed gripper for precision photonics assembly and analysis. SUMMARYPhotonics is a field that straddles both the macro and micro worlds. It largely deals with macro-scale devices, but many of these require sub-micron-scale precision in assembly. This makes it a very interesting application domain. We describe a microgripper for microassembly of photonic devices and micro-exploration of the properties of sub-micron attachment means (such as solder and UV epoxy). The microgripper has multi-degree-of-freedom actuation and a unique micro/macro actuator on the gripping axis to facilitate human loading and unloading and also very precise accommodation. We demonstrate the force sensitivity and stiffness of approximately 20 mN and 70 mN/um, respectively to be sufficient for the intended tasks. Finally, we demonstrate the gripper accommodating forces of a large solder ball freezing and cooling as a prelude to our intended study of sub-millimeter solder balls in sub-second heating regimes.

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“…high centering accuracy (<0.1 mm), -high stability (sub-micron range), low stress and non-deformation of the optical shape, otherwise the instrument response will fluctuate, birefringence will be induced and the data/image will be distorted, -high cleanliness -chemical pollution has to be avoided as interaction of contamination with the high power laser that could reduce the optical performance, and eventually cause catastrophic failure (molecular: level A MIL-STD-1246 <0.05·10 -6 g/cm 2 ; particles: <50 ppm), -no organic compounds, the instrument will be mounted in a controlled atmosphere with only noble materials to avoid pollution and outgassing. …”

Section: Introductionmentioning

confidence: 99%

“…Soldering can guarantee a high level of cleanliness, avoids organic pollution and outgassing, whilst also assuring the high robustness and vacuum compatibility needed for the assembly and packaging of opto-mechanical space devices. Different laser based soldering techniques offering a localized input of thermal energy can be used to replace former space used optical-arrangements, for example: by bonding with laser beam transmission onto thin film solder layers [1], by a surface-mounted device assembly technique for small optics based on laser reflow soldering [2], with a method and device for connecting an optical element to a frame [3], or with a laser-based Solderjet Bumping technology [4]. Solderjet Bumping technology ( Fig.…”

Section: Introductionmentioning

confidence: 99%

Low-stress soldering technique used to assemble an optical system for aerospace missions

Ribes-Pleguezuelo

Koechlin²,

Burkhardt

et al. 2017

International Conference on Space Optics — ICSO 2016

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A high-precision opto-mechanical breadboard for a lens mount has been assembled by means of a laserbased soldering process called Solderjet Bumping; which thanks to its localized and minimized input of thermal energy, is well suited for the joining of optical components made of fragile and brittle materials such as glasses. An optical element made of a silica lens and a titanium barrel has been studied to replicate the lens mounts of the afocal beam expander used in the LIDAR instrument (ATLID) of the ESA EarthCare Mission, whose aim is to monitor molecular and particle-based back-scattering in order to analyze atmosphere composition. Finally, a beam expander optical element breadboard with a silica lens and a titanium barrel was assembled using the Solderjet Bumping technology with Sn96.5Ag3Cu0.5 SAC305 alloy resulting in a low residual stress (< 1 MPa) on the joining areas, a low light-depolarization (<0.2 %) and low distortion (wave-front error measurement < 5 nm rms) on the assemblies. The devices also successfully passed humidity, thermal-vacuum, vibration, and shock tests with conditions similar to the ones expected for the ESA EarthCare mission and without altering their optical performances.

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An innovative micro optical element assembly robot characterized by high accuracy and flexibility

Cited by 7 publications

References 2 publications

A surface-mounted device assembly technique for small optics based on laser reflow soldering

A surface-mounted device assembly technique for small optics based on laser reflow soldering

Micro/macro force-servoed gripper for precision photonics assembly and analysis

Low-stress soldering technique used to assemble an optical system for aerospace missions

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