OSA Optical Sensors and Sensing Congress 2021 (AIS, FTS, HISE, SENSORS, ES) 2021
DOI: 10.1364/hise.2021.hf4e.5
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An Innovative Photonic Integrated Channelizer Design for Hyperspectral Microwave Sounding

Abstract: A photonic integrated channelizer is designed for hyperspectral and ultra-high band coverage remote sensing applications. The tunable delay lines maximize the transmission performance and the device demonstrates 4.5 GHz of optical bandwidth and channel separation.

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Cited by 7 publications
(9 citation statements)
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“…Preliminary results demonstrate the feasibility of this photonic approach [57], [58]. Photonic integrated circuits (PICs) are used to divide the wideband spectrum into narrower channels, which would previously have been done using RF or IF filters.…”
Section: A Emerging Technologymentioning
confidence: 96%
“…Preliminary results demonstrate the feasibility of this photonic approach [57], [58]. Photonic integrated circuits (PICs) are used to divide the wideband spectrum into narrower channels, which would previously have been done using RF or IF filters.…”
Section: A Emerging Technologymentioning
confidence: 96%
“…Recent advances in Photonic Integrated Circuits (PICs) have opened a new era of hyperspectral microwave instrument development. SWaP-C can be improved by means of photonic signal processing techniques, enabled by up-conversion of a microwave signal to an optical carrier [4]. Our team at GSFC has been awarded the development of a Hyperspectral Microwave Photonic Instrument (HyMPI), which aims to solve the SWaP-C challenge of current RF technology by combining Photonic Integrated Circuits (PICs) and Application Specific Integrated Circuits (ASICs) into a "PICASIC" module [4,5].…”
Section: The Hyperspectral Microwave Photonic Instrument (Hympi)mentioning
confidence: 99%
“…SWaP-C can be improved by means of photonic signal processing techniques, enabled by up-conversion of a microwave signal to an optical carrier [4]. Our team at GSFC has been awarded the development of a Hyperspectral Microwave Photonic Instrument (HyMPI), which aims to solve the SWaP-C challenge of current RF technology by combining Photonic Integrated Circuits (PICs) and Application Specific Integrated Circuits (ASICs) into a "PICASIC" module [4,5]. The results will yield a low mass, low power, high spectral resolution, and wide band instrument.…”
Section: The Hyperspectral Microwave Photonic Instrument (Hympi)mentioning
confidence: 99%
“…Recent advances in Photonic Integrated Circuits (PICs) technology have opened a new era of hyperspectral microwave instrument development. SWaP-C can be improved by means of photonic signal processing techniques, enabled by up-conversion of a microwave signal to an optical carrier [2]. Our team at GSFC has been awarded the development of a Hyperspectral Microwave Photonic Instrument (HyMPI), which aims to solve the SWaP-C challenge of current RF technology by combining Photonic Integrated Circuits (PICs) and Application Specific Integrated Circuits (ASICs) into a "PICASIC" module [2].…”
Section: Introductionmentioning
confidence: 99%
“…SWaP-C can be improved by means of photonic signal processing techniques, enabled by up-conversion of a microwave signal to an optical carrier [2]. Our team at GSFC has been awarded the development of a Hyperspectral Microwave Photonic Instrument (HyMPI), which aims to solve the SWaP-C challenge of current RF technology by combining Photonic Integrated Circuits (PICs) and Application Specific Integrated Circuits (ASICs) into a "PICASIC" module [2]. The results will yield a low mass, low power, high spectral resolution and wide band instrument.…”
Section: Introductionmentioning
confidence: 99%