An integrated design approach for the hardware optimization of electrical power modules for automotive electrotraction

Abstract

In this paper a systematic approach is presented for the design and optimization of forced liquid cooled electronic modules with high power dissipation. The steps of the design cycle include hydrodynamical evaluation of the heat sink, thermal management, thermomechanical optimization and especially lifetime prediction of soldered joints. Utilized engineering tools comprise Computational Fluid Dynamics, Finite Differences and Finite Element programs. These are coupled via software interfaces in order to enable data exchange as well as efficient cooperation of the designers. Applying these deans, performance, reliability and costs of a certain module have been optimized. By use of a design-for-reliability procedure substantial savings with regard to development time, prototyping effort and consequently costs can been achieved.. .

Reliability modeling of Sn–Ag transient liquid phase die-bonds for high-power SiC devices

“…The crack propagation rates in the die-attach layer were modeled using Paris' Law [30], which is given by Eq. (3).…”

“…28. Both experimental and simulation data were fitted to a mathematic model which is the form of Paris' Law [30]. Consequently, the material parameters C1 and C2 were determined for both TLP bonded and Ag-sintered layers and are mentioned in Table 11.…”

An experimental and computational study of water cooled heatsinks for HEV's

“…Investigation of recent liquid cooled power modules revealed a trend towards more intricate heatsink designs to improve the heat transfer ability in closed single [3], pin-fin geometries [4] and jet impingement techniques [5]. This trend reflects manufacturers need for ever greater semiconductor dissipation rates (in excess of 200W/cm 2 ).…”