An investigation into the characteristics of deep reactive ion etching of quartz using SU-8 as a mask

Chen, H; Fu, Chi Yung

doi:10.1088/0960-1317/18/10/105001

Cited by 22 publications

(9 citation statements)

References 19 publications

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“…Also, a SU8 thick photoresist has been used as a hard mask for quartz etching. 21 In our case, we find that the submicron dimensions of the quartz cylinders require a thin (30 nm) hard mask layer. Following LIL patterning, the chromium layer is etched with an Ar plasma in the absence of oxygen, using a Corial 250D ICP RIE (200 W RF and 400 W LF).…”

Section: Quartz Microcylinders Fabricationmentioning

confidence: 59%

Fabrication of quartz microcylinders by laser interference lithography for angular optical tweezers

Santybayeva

Meghit

Desgarceaux

et al. 2016

J. Micro/Nanolith. MEMS MOEMS

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Abstract. The use of optical tweezers (OTs) and spin angular momentum transfer to birefringent particles allows new mechanical measurements in systems where torque and rotation are relevant parameters at the singlemolecule level. There is a growing interest in developing simple, fast, and inexpensive protocols to produce a large number of submicron scale cylinders of quartz, a positive uniaxial birefringent crystal, to be employed for such angular measurements in OTs. Here, we show that laser interference lithography, a method well known for its simplicity, fulfills these requirements and produces quartz cylindrical particles that we successfully use to apply and measure optical torque in the piconewton nm range in an optical torque wrench. © The Authors. Published by SPIE under a Creative Commons Attribution 3.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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Section: Quartz Microcylinders Fabricationmentioning

confidence: 59%

Fabrication of quartz microcylinders by laser interference lithography for angular optical tweezers

Santybayeva

Meghit

Desgarceaux

et al. 2016

J. Micro/Nanolith. MEMS MOEMS

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“…The process of quartz glass etching consumes fluorine atoms, combining them with silicon atoms to form SiF x gas, which readily evaporates. However, the discharged oxygen reacts with CF x radicals in quartz glass etching to form CO, CO 2 and COF 2 , which readily evaporate [29]. Hence, the chemical deposition accelerates ion bombardment and results in anisotropic etching.…”

Section: Experimental Description and Procedurementioning

confidence: 99%

Comparison of optimised conditions for inductively coupled plasma‐reactive ion etching of quartz substrates and its optical applications

Tang

Lin

Chen

et al. 2014

Micro & Nano Letters

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A C 4 F 8 /He inductively coupled plasma-reactive ion etching (ICP-RIE) was studied to improve the etching conditions of quartz glass. The influences of C 4 F 8 flow rate, He flow rate, chamber pressure, inductively coupled plasma (ICP) power, bias power and cooling temperature were investigated. A report is presented on an optimum etching condition for fabricating quartz-based optical components considering their application in diffractive optical element (DOE) devices. As per these etching results, the etched microstructure exhibited a depth of 44.2 μm and a vertical sidewall angle of 89°resulting from an ICP power of 3000 W, a bias power of 200 W, a chamber pressure of 2.5 mTorr and an etching time of 120 min in a mixture of C 4 F 8 and He gases with 30 and 100 sccm flow rates, respectively. The successful fabrication of the DOE component by ICP-RIE is reported. This can be used to provide the uniform light intensity distribution for a DOE device.

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“…Several typical masks, such as metal masks, photoresist masks and metallic compound masks have been discussed so far [ 24 , 28 , 34 , 35 , 36 , 37 , 38 , 39 , 40 , 41 , 42 , 43 ]. It is known that the deep and high etching rate of glasses is not feasible with standard photoresist masks due to low selectivity and mask profile degradation during the prolonged process [ 37 , 38 ]. Therefore, other masks have drawn much attention in recent years.…”

Section: Introductionmentioning

confidence: 99%

Deep Reactive Ion Etching of Z-Cut Alpha Quartz for MEMS Resonant Devices Fabrication

Zhao

et al. 2020

Micromachines

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Quartz is widely used in microelectromechanical systems (MEMS). Especially, MEMS quartz resonators are applied to sensors and serve as sensitive elements. The capability of deep etching is a limitation for the application. Presented in this paper is a deep and high accuracy reactive ion etching method applied to a quartz resonator etching process with a Cr mask. In order to enhance the capability of deep etching and machining accuracy, three kinds of etching gas (C4F8/Ar, SF6/Ar and SF6/C4F8/Ar), bias power, inductively coupled plasma (ICP) power and chamber pressure were studied in an industrial reactive ion etching machine (GDE C200). Results indicated that the SF6/C4F8/Ar chemistry gas is the suitable and optimal choice. Experiment results indicate that Cr (chromium) mask can obtain a higher selectivity than aluminum and titanium mask. A “sandwich” structure composed of Al layer-Cr layer-Al layer-Cr layer was proposed. The Al (aluminum) film can play the role of releasing stress and protecting gold electrodes, which can enhance the thickness of metal mask. An optimized process using SF6/C4F8/Ar plasmas showed the quartz etching rate of 450 nm/min. Meanwhile, a microchannel with a depth of 75.4 µm is fabricated, and a nearly vertical sidewall profile, smooth surface is achieved.

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An investigation into the characteristics of deep reactive ion etching of quartz using SU-8 as a mask

Cited by 22 publications

References 19 publications

Fabrication of quartz microcylinders by laser interference lithography for angular optical tweezers

Fabrication of quartz microcylinders by laser interference lithography for angular optical tweezers

Comparison of optimised conditions for inductively coupled plasma‐reactive ion etching of quartz substrates and its optical applications

Deep Reactive Ion Etching of Z-Cut Alpha Quartz for MEMS Resonant Devices Fabrication

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