An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder

Lin, D. C.; Liu, S.; Tai-ming, Guo; Wang, Guoxiang; Srivatsan, T. S.; Petraroli, M.

doi:10.1016/s0921-5093(03)00466-0

Cited by 84 publications

(46 citation statements)

References 7 publications

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“…Mixing solder alloy powders with reinforcement particles is a method by mixing pre-casted solder alloy powders and then mechanical mixing with reinforcement particles. Lin et al [70] [71,72] and Liu et al [73] fabricated reinforced solders by mixing nano-sized particles with Sn-Pb solder powders.…”

Section: Fabrication Methods Of Reinforced Soldersmentioning

confidence: 99%

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Salleh¹,

Anuar²

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Electronics manufacturers are pushing the limits in reducing the physical size of circuitry while simultaneously increasing the number of transistors to satisfy Moore's Law [1]. This includes investing in new materials, and configuring new ways to manufacture complex 3D (three dimensional) electronic packaging [1]. One key requirement of new materials and techniques is ensuring the high reliability of the resultant products in various challenging operating environments including thermal and mechanical extremes [2][3][4]. A viable method to enhance the properties and performance of a solder joint is by incorporation of reinforcement particles to the solder matrix, either by intrinsic or extrinsic methods. In this thesis a series of Sn-Cu Pb-free solder alloys with extrinsic or intrinsic phase reinforcement were manufactured and the microstructure and soldering behavior were investigated in detail.Additions of extrinsic reinforcement in the form of nano-sized ceramic material were made using a microwave sintering powder metallurgy (PM) method, which is a viable method to improve the mechanical and thermal properties of Pb-free solder materials. In addition, the advanced processing routes ensures a homogenous distributions of reinforcement particles is present. To investigate the performance of the reinforced bulk solders including thermal and mechanical properties and relate this to the microstructure, samples were investigated using techniques such as synchrotron micro-XRF, HRTEM, SEM, XPS, dilatometery, DSC and shear and microhardness testing. A hypothesis of how reinforcement improves solder properties is developed and discussed. Synchrotron X-ray radiography imaging (SXRI) was used to analyse the development of microstructure and the complex interactions occurring in the solders. Based on the properties of the fabricated solder, the microwave sintering PM route was discussed as a promising method for the reinforcement of Pb-free solders.The initial formation of interfacial IMC products was studied in Sn-Cu based solder alloys by in situ experiment techniques such as SXRI and UHV-TEM. The results provide direct experimental evidence of real-time initial Cu6Sn5 layer development during soldering and also the stress creation and release events that arise due to the polymorphic transformations of the Cu6Sn5 phase and the associated volumetric change.ii In addition, the nucleation and growth behavior of primary intermetallics which can be considered an intrinsic reinforcing material in solder joints was studied. Here, the nucleation and growth behavior of primary Cu6Sn5 and β-Sn crystals in some of the most commonly used solder alloys including Sn-0.7Cu and Sn-3.0Ag-0.5Cu is explained. This also includes the effects of Ni additions for refining primary Cu6Sn5 in Sn-Cu solder joints. Using SXRI, observations were made during solder joint solidification, which is difficult using conventional methods. The initial nucleation and solidification kinetics of primary Cu6Sn5 crystals were discussed.The growth of pri...

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Section: Fabrication Methods Of Reinforced Soldersmentioning

confidence: 99%

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Salleh¹,

Anuar²

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“…This finding is consistent with that of other researchers who worked on nanosized copper additions in Sn-Pb solders. 16 Figure 5 shows the distribution of Cu and its related phase in the Sn-1.35wt.%Cu solder matrix after the reflow process. EDS point analysis was conducted on the samples in order to provide an insight into the distribution of Cu.…”

Section: Microstructural Characterizationmentioning

confidence: 99%

Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates

Alam

Nai

Gupta

2009

Journal of Elec Materi

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In the present study, Sn-Cu solders were synthesized using pure tin with varying weight percentage of nanosized copper particles (0 wt.%, 0.25 wt.%, 0.43 wt.%, 0.86 wt.%, and 1.35 wt.%) by a powder metallurgy route incorporating microwave-assisted sintering. Intermetallic compound (IMC) layer formation between Sn-Cu solders and Cu substrates was investigated following a reflow process. Isothermal aging studies were also conducted on selected Sn-Cu solders at 150°C for up to 4 weeks. Results revealed that the average IMC layer thickness decreases with the addition of nanocopper up to 0.43 wt.%. Beyond 0.43 wt.% Cu addition, the IMC layer thickness started to increase, and the maximum IMC layer thickness was found for Sn with 1.35 wt.% Cu addition. An attempt was made in this study to correlate the effect of nanocopper additions and aging time on the IMC layer thicknesses.

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“…Importantly, with the advancement in the nanotechnology, many new nanoparticles have been synthesized and used as the dispersed phases in the solders (i.e., the nanocomposite solders) to enhance their mechanical properties [10]. However, the improvement in the fatigue strength and creep resistance comes with the alteration of the other properties of the solder, such as wettability and microstructure [11][12][13][14][15][16][17][18][19].…”

Section: Introductionmentioning

confidence: 99%

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Kanlayasiri

Meesathien

2018

Advances in Materials Science and Engineering

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is research investigates the effects of zinc oxide (ZnO) nanoparticles of varying concentrations 0.0, 0.25, 0.50, 0.75, and 1.0 wt.% on the melting temperatures, wettability, printability, slump, and interfacial microstructure of the ZnO-doped Sn-0.3Ag-0.7Cu lead-free solder pastes on the copper substrate. e results revealed that the introduction of the ZnO particles had no effect on the solidus and liquidus temperatures of the solders. e maximum wettability was achieved with 0.25 wt.% ZnO nanoparticles, while the printability was inversely correlated with the nano-ZnO concentrations. e findings also indicated that, at room temperature, the slumping and the nano-ZnO concentrations were positively correlated and that, under the 150°C thermal condition, the maximum slumping was achieved with 0.25 wt.% ZnO. e slumping mechanism of the SAC0307-xZnO solder pastes is also provided herein. Moreover, the experiments showed that Cu 6 Sn 5 was the single intermetallic compound present in the interfacial layer between the solders and the copper substrate, with the maximum intermetallic layer thickness realized at the 0.25 wt.% ZnO concentration.

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An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder

Cited by 84 publications

References 7 publications

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

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