An investigation of structural transformation during the solidification of copper-gallium alloys

Tikhomirova, O. I.; Пикунов, М. В.; Marchukova, I. D.; Tochenova, I.N.; Izotova, I. P.

doi:10.1007/bf00730341

Cited by 13 publications

(9 citation statements)

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“…In Hume-Rothery's work [11,12], the and phases [10] were not found. Later, several investigations [14][15][16][17][18][19][20][21][22][23][24][25] have been reported on the Cu-Ga system and the results are similar to those of Hume-Rothery and coworkers [11,12].…”

Section: Literature On Phase Relationssupporting

confidence: 71%

Subsolidus phase relations of the Cu–Ga–N system

Zhang

Liang

et al. 2007

Journal of Alloys and Compounds

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Section: Literature On Phase Relationssupporting

confidence: 71%

Subsolidus phase relations of the Cu–Ga–N system

Zhang

Liang

et al. 2007

Journal of Alloys and Compounds

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“…The formation of such IMCs consumes gallium in the EGaIn matrix and results in a compositional shift and melting point increase since CuGa 2 IMC has a high melting point. [ 24 ] The above reaction leads to a gradual solidification of EGaIn‐Cu composites. If the EGaIn surface oxide is chemically removed by NaOH (aq), copper and gallium will come into direct contact and CuGa 2 IMCs start to form within several minutes after mixing.…”

Section: Introductionmentioning

confidence: 99%

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

et al. 2021

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Gallium‐based liquid metal (LM) composite with metallic fillers is an emerging class of thermal interface materials (TIMs), which are widely applied in electronics and power systems to improve their performance. In situ alloying between gallium and many metallic fillers like copper and silver, however, leads to a deteriorated composite stability. This paper presents an interfacial engineering approach using 3‐chloropropyltriethoxysilane (CPTES) to serve as effective thermal linkers and diffusion barriers at the copper‐gallium oxide interfaces in the LM matrix, achieving an enhancement in both thermal conductivity and stability of the composite. By mixing LM with copper particles modified by CPTES, a thermal conductivity (κ) as high as 65.9 W m−1 K−1 is achieved. In addition, κ can be tuned by altering the terminal groups of silane molecules, demonstrating the flexibility of this approach. The potential use of such composite as a TIM is also shown in the heat dissipation of a computer central processing unit. While most studies on LM‐based composites enhance the material performance via direct mixing of various fillers, this work provides a different approach to fabricate high‐performance LM‐based composites and may further advance their applications in various areas including thermal management systems, flexible electronics, consumer electronics, and biomedical systems.

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“…21,22 The decomposition of CuGa 2 results in corrosive liquid Ga precipitation which potentially could react with many metal components in the device. Meanwhile, a volume shrinkage would occur due to the different densities (θ-CuGa 2 28.15 cm 3 /mol, 23 γ 3 -Cu 9 Ga 4 99.74 cm 3 /mol, 24 and liquid Ga 10.58 cm 3 /mol 25 ). Therefore, the CuGa 2 phase stability during heating is of great importance for the joint reliability.…”

Section: Introductionmentioning

confidence: 99%

“…Joule heating and subsequent cooling during the servicing of the electronic device can cause volume and phase changes of individual components in solder joints, and therefore result in failures such as thermo-mechanical fatigue. , The decomposition of CuGa 2 results in corrosive liquid Ga precipitation which potentially could react with many metal components in the device. Meanwhile, a volume shrinkage would occur due to the different densities (θ-CuGa 2 28.15 cm 3 /mol, γ 3 -Cu 9 Ga 4 99.74 cm 3 /mol, and liquid Ga 10.58 cm 3 /mol). Therefore, the CuGa 2 phase stability during heating is of great importance for the joint reliability.…”

Section: Introductionmentioning

confidence: 99%

Effects of Ni and Cu Antisite Substitution on the Phase Stability of CuGa₂ from Liquid Ga/Cu–Ni Interfacial Reaction

Liu¹,

Yang²,

Kawami

et al. 2019

ACS Appl. Mater. Interfaces

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Ga and Ga-based alloys have received significant attention for applications in the liquid state and also for their potential as a bonding material in microelectronic assemblies. This study investigates the phase stability of the CuGa2 phase as a product of the interfacial reaction between liquid Ga and Cu–10Ni substrates at room temperature. In the binary Ga–Cu system, CuGa2 is decomposed into liquid Ga and Cu9Ga4 as the temperature increases to around 260 °C, which prevents the widespread application of this alloy. In contrast to CuGa2 grown from a pure Cu substrate, CuGa2 from the Cu–10Ni substrate shows an increase in the decomposition temperature during heating from 25 to 300 °C. According to our first-principle calculations, there is only a minor difference in the total free energy between Ni solute at the Cu sublattice and the Ga sublattice in the tetragonal CuGa2 crystal structure. This result indicates that both of the sublattices can accommodate the dilute Ni solute with comparable probability. Regardless of the sublattice where the Ni impurities are located, the presence of diluted Ni in the matrix stabilizes the CuGa2 system by inducing some localized Ni 3d states at energy levels near the Fermi level. It is also shown that the formation of Cu antisite defects, which also stabilizes CuGa2, is preferable if the CuGa2 matrix is grown on a Ni-containing substrate.

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An investigation of structural transformation during the solidification of copper-gallium alloys

Cited by 13 publications

References 1 publication

Subsolidus phase relations of the Cu–Ga–N system

Subsolidus phase relations of the Cu–Ga–N system

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Effects of Ni and Cu Antisite Substitution on the Phase Stability of CuGa₂ from Liquid Ga/Cu–Ni Interfacial Reaction

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An investigation of structural transformation during the solidification of copper-gallium alloys

Cited by 13 publications

References 1 publication

Subsolidus phase relations of the Cu–Ga–N system

Subsolidus phase relations of the Cu–Ga–N system

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Effects of Ni and Cu Antisite Substitution on the Phase Stability of CuGa2 from Liquid Ga/Cu–Ni Interfacial Reaction

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Product

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Effects of Ni and Cu Antisite Substitution on the Phase Stability of CuGa₂ from Liquid Ga/Cu–Ni Interfacial Reaction