An investigation of the effect of grounding pads on power bus resonance characteristics

Morishita, K.; Hubing, T.H.; He, Xin‐Tao; Kobayashi, Naoki; Harada, Takashi

doi:10.1109/isemc.2009.5284693

Cited by 3 publications

(1 citation statement)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Here must be included an important remark to escape from misunderstanding. When locating the grounding vias at places where the voltage potentials are high, they can affect the resonance characteristics, while locating them at low voltages is not a concern and does not disturb the performance [10]. Otherwise stated, no frequency shifts occur in the cavity mode resonances [11].…”

Section: T Electromagnetic Simulations and Experimental Modelsmentioning

confidence: 99%

Some considerations of via stitching impact on parasitic coupling of RF multiports in multilayer packages and MCMs

Arnaudov

2012

2012 IEEE 11th International Conference on Actual Problems of Electronics Instrument Engineering (APEIE)

View full text Add to dashboard Cite

Electromagnetic cavity-resonance modes in parallel-plate planes of power and ground rectangular structures along with parasitic coupling between excitation RF multiports are investigated. Such structures are widely used in microwave multilayer packages, MCMs and could be the source of considerable electromagnetic interference (EMI). Effective methods should be applied for damping and elimination of the radiated fields, especially in small areas and volumes. The investigated three-layered LTCC microwave package (QFN-type) possesses two separate grounding planes on different levels, connected through multiple shielding vias. The estimation of the electromagnetic field distribution is conducted by full-wave analysis of the proposed cavity-resonance models and corresponding S-parameters are extracted. This paper also discusses the influence of matrixlike via grid distribution on the propagation constant and effective dielectric permittivity of exemplary structures in the frequency band of interest -10 to 30 GHz.Index Terms-Cavity-resonance modes, QFN microwave packages, MCM, multilayer LTCC, electromagnetic interference (EMI), full-wave analysis, propagation constant, effective dielectric constant.

show abstract

Section: T Electromagnetic Simulations and Experimental Modelsmentioning

confidence: 99%

Some considerations of via stitching impact on parasitic coupling of RF multiports in multilayer packages and MCMs

Arnaudov

2012

2012 IEEE 11th International Conference on Actual Problems of Electronics Instrument Engineering (APEIE)

View full text Add to dashboard Cite

show abstract

Some considerations of via stitching impact on parasitic coupling of RF multiports in multilayer packages and MCMs

Arnaudov

2012

2012 IEEE 11th International Conference on Actual Problems of Electronics Instrument Engineering (APEIE)

View full text Add to dashboard Cite

Design considerations for high-voltage DC bus architecture and wire mechanization for hybrid and electric vehicle applications

Anwar

Gleason

Grewe

2010

2010 IEEE Energy Conversion Congress and Exposition

View full text Add to dashboard Cite

An investigation of the effect of grounding pads on power bus resonance characteristics

Cited by 3 publications

References 7 publications

Some considerations of via stitching impact on parasitic coupling of RF multiports in multilayer packages and MCMs

Some considerations of via stitching impact on parasitic coupling of RF multiports in multilayer packages and MCMs

Some considerations of via stitching impact on parasitic coupling of RF multiports in multilayer packages and MCMs

Design considerations for high-voltage DC bus architecture and wire mechanization for hybrid and electric vehicle applications

Contact Info

Product

Resources

About