Proceedings of IEEE International Electron Devices Meeting
DOI: 10.1109/iedm.1993.347327
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An LCD addressed by a-Si:H TFTs with peripheral poly-Si TFT circuits

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Cited by 27 publications
(16 citation statements)
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“…The use of low thermal budget ( 600 C), and less expensive substrate materials such as plastic and glass makes TFTs a low-cost choice for a wide range of applications such as active matrix liquid crystal displays (AMLCDs) [1], and memory devices [2]. With the possibility of monolithic integration of CMOS drivers and other peripheral circuit elements, poly-Si TFTs have paved the way for system on-panel device integration [4].…”
Section: Introductionmentioning
confidence: 99%
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“…The use of low thermal budget ( 600 C), and less expensive substrate materials such as plastic and glass makes TFTs a low-cost choice for a wide range of applications such as active matrix liquid crystal displays (AMLCDs) [1], and memory devices [2]. With the possibility of monolithic integration of CMOS drivers and other peripheral circuit elements, poly-Si TFTs have paved the way for system on-panel device integration [4].…”
Section: Introductionmentioning
confidence: 99%
“…L OW temperature polycrystalline silicon (Poly-Si) thin-film transistors (TFTs) on insulating substrates such as glass and plastics, even at sub-100 nm channel lengths, are aggressively investigated in the literature [1]- [9]. The use of low thermal budget ( 600 C), and less expensive substrate materials such as plastic and glass makes TFTs a low-cost choice for a wide range of applications such as active matrix liquid crystal displays (AMLCDs) [1], and memory devices [2].…”
Section: Introductionmentioning
confidence: 99%
“…The low-cost of LTPS TFT is attributed to low thermal budget (<500°C), simple fabrication process, and less expensive substrate materials such as plastic and glass than silicon. However, state-of-art LTPS TFT technology has limited applications -mainly for liquid crystal displays (LCDs) [1]. This is primarily due to its low current drivability and performance variability due to the presence of grain boundaries (GBs) in the poly-Si channel.…”
Section: Introductionmentioning
confidence: 99%
“…Microstructural characteristics (roughness and grain size) were measured and their dependence on germane content to the gas flow during deposition elucidated using a range of analysis techniques, including fractal methods. By tracking the evolution of cross-over points in the fractal spectrum, an estimate for the grain size range can be obtained, which tallies extremely well with actual topographical measurements.Thin film transistors (TFTs) are employed in a number of advanced technological environments such as high-density static random access memory (SRAM) for load pull-up devices [1, 2] and also as large-area active matrix liquid crystal displays (AMLCDs) for both switching elements and peripheral driver circuitry [3,4]. Although polycrystalline Si (polySi) is widely used as the active layer in TFT applications, the performance of the device is degraded if the processing temperature is decreased [5].…”
mentioning
confidence: 99%
“…Thin film transistors (TFTs) are employed in a number of advanced technological environments such as high-density static random access memory (SRAM) for load pull-up devices [1, 2] and also as large-area active matrix liquid crystal displays (AMLCDs) for both switching elements and peripheral driver circuitry [3,4]. Although polycrystalline Si (polySi) is widely used as the active layer in TFT applications, the performance of the device is degraded if the processing temperature is decreased [5].…”
mentioning
confidence: 99%