“…In wear-out mechanism, thermomechanical stress plays a very important role in affecting power electronic devices/modules reliability, such as the fractures propagation and degradations in solder layers, wire-bond lift-off and emitter metallization [6,2,7,8,9]. The failure mechanisms are influenced by both environmental and load conditions [10,11]. To address this issue, research has addressed different aspects, for example, new semiconductor and materials technologies [12,13], package architecture [14], interconnection [15], control of power electronic modules [16] and advanced cooling technologies [6,17].…”