An optimization method of ultra hign speed differential structure for BGA package

Jin, Nong; Qiao, Zhizhuang; Liu, Linjie; Wang, Ke; Zhou, Yangfan; Ren, Z.

doi:10.1109/icept52650.2021.9567946

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2022

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“…Wang et al [7] analyzed the potential influencing factors of BGA, such as shape, center distance and misalignment in the bands from DC to 20 GHz using a finite element simulation software. Jin et al [8] provided an optimization method for the differential structure of an ultra-high speed BGA package through vertical via impedance adjustment technology and ball matching compensation technology. Sun et al [9] presented the RF characteristics of ball grid array transition with a frequency range from 100 MHz to 40 GHz.…”

Section: Introductionmentioning

confidence: 99%

Impact of ground solder ball failure in BGA package on near electric field radiation

Yuan

Zhang

Wang

et al. 2022

IEICE Electron. Express

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In this paper, the impact of ground solder ball failure in ball grid array (BGA) package on near electric field radiation was investigated from the perspectives of both theoretical modelling and experimental testing. Based on the structural and material parameters, a 3D electromagnetic field numerical calculation model of circuit boards with failed ground solder balls was developed. The influences of both different number of failed ground solder balls and different signal frequencies on near electric field radiation was calculated. The electromagnetic field model results are validated using experimental tests.

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Section: Introductionmentioning

confidence: 99%