An opto-electrical method for measuring the gap of LCD glass plates

Cho, Jason; Lin, Chern‐Sheng; Jan, Ben Jamin; Lin, Chan-Shing; Chang, Nin-Chun

doi:10.1016/j.optlastec.2004.10.003

Cited by 6 publications

(2 citation statements)

References 8 publications

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“…where Du is the rotation angle. After coordinate transformation, the coordinates of various pixels of the chip calibration reference mark image in the standard image can be calculated and substituted in sub-pixel interpolation (Lin and Yang, 2014;Cho et al, 2005;Lin et al, 2007), as shown in Figure 3. The gray level of the reference standard image corresponding to the chip calibration reference mark image position can be obtained, where GI is the standard image (Golden Image), with its coordinate position expressed as (GI xi , GI yi ), the gray level of the standard image; RE is the Reference Image, with its coordinate position expressed as (RE x , RE y ), the gray level of the reference standard image.…”

Section: Sub-pixel Image Processing In Dynamic Imaging Conditionmentioning

confidence: 99%

Optical alignment and compensation control of die bonder for chips containing through-silicon vias

Lin

Hung

Chen

et al. 2019

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Purpose This study aims to present an optical alignment and compensation control of die bonder for chips containing through-silicon vias and develop three-dimensional integrated circuit stacked packaging for compact size and multifunction. Design/methodology/approach The machine vision, optical alignment method and sub-pixel technology in dynamic imaging condition are used. Through a comparison of reference image, the chip alignment calibration can improve machine accuracy and stability. Findings According to the experimental data and preliminary results of the analysis, accuracy can be achieved within the desired range, and the accuracy is much better than traditional die bonder equipment. The results help further research in die bonder for chips containing through-silicon vias. Originality/value In subsequent testing of the chip, the machine can simultaneously test multiple chips to save test time and increase productivity.

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Section: Sub-pixel Image Processing In Dynamic Imaging Conditionmentioning

confidence: 99%

Optical alignment and compensation control of die bonder for chips containing through-silicon vias

Lin

Hung

Chen

et al. 2019

View full text Add to dashboard Cite

show abstract

“…As the CLM method [6,7], the sample pattern or the laser spot model should be created in advance using interpolation method for higher the estimation precision of the sub-pixel [8,9].…”

Section: Introductionmentioning

confidence: 99%