2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) 2016
DOI: 10.1109/memsys.2016.7421580
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An origami-inspired ultrastretchable bioprobe film device

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Cited by 13 publications
(7 citation statements)
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“…Conventionally employed electronic materials with pristine forms (e.g., thin-film metals or semiconductors) exhibit a significant increase in electrical resistance with accumulating strain owing to their structural irreversibility. A variety of approaches have been explored to convert intrinsically brittle electronic materials to stress-resilient forms by rationally engineering their physical configurations and dimensions. Among them, forming the materials into “kirigami” patterns inspired by the ancient paper-cutting art , offers distinguishable advantages for efficiently relieving external stress. This kirigami patterning employs rows of designed cuts to a planar material, which improves its mechanical stretchability by converting applied tensile stress to torsional stress at specific points between the cuts. In addition to structural “engineering” approaches, substantive efforts have been used to identify a new form of electronic materials which intrinsically possess suitable crystallinity to enable superior mechanical tolerance. In this endeavor, recently explored two-dimensional (2D) transition-metal dichalcogenides (TMDs) present highly unique and promising aspects. , For instance, they exhibit significantly larger in-plane strain limits over covalently bonded three-dimensional crystals owing to their van der Waals molecular bonding, offering opportunities for futuristic stretchable electronics. , Despite the projected advantages, combining these two different compelling approaches (i.e., converting 2D TMDs into kirigami forms) has been rarely attempted, leaving their anticipated mechanoelectrical superiority largely unexplored.…”
mentioning
confidence: 99%
“…Conventionally employed electronic materials with pristine forms (e.g., thin-film metals or semiconductors) exhibit a significant increase in electrical resistance with accumulating strain owing to their structural irreversibility. A variety of approaches have been explored to convert intrinsically brittle electronic materials to stress-resilient forms by rationally engineering their physical configurations and dimensions. Among them, forming the materials into “kirigami” patterns inspired by the ancient paper-cutting art , offers distinguishable advantages for efficiently relieving external stress. This kirigami patterning employs rows of designed cuts to a planar material, which improves its mechanical stretchability by converting applied tensile stress to torsional stress at specific points between the cuts. In addition to structural “engineering” approaches, substantive efforts have been used to identify a new form of electronic materials which intrinsically possess suitable crystallinity to enable superior mechanical tolerance. In this endeavor, recently explored two-dimensional (2D) transition-metal dichalcogenides (TMDs) present highly unique and promising aspects. , For instance, they exhibit significantly larger in-plane strain limits over covalently bonded three-dimensional crystals owing to their van der Waals molecular bonding, offering opportunities for futuristic stretchable electronics. , Despite the projected advantages, combining these two different compelling approaches (i.e., converting 2D TMDs into kirigami forms) has been rarely attempted, leaving their anticipated mechanoelectrical superiority largely unexplored.…”
mentioning
confidence: 99%
“…In a first approach, straight-lined micro-channels were studied, and fairly large dimensions were chosen to determine a stable fabrication process (Sect. 2.2) an overall behavior of the micro-channels, which then were reduced to aim for the resolution of already existing or in development stimulation devices, 4,[9][10][11] as shown in Table I. The choice of the liquid metal alloy was made considering the future in-vivo conditions of the device.…”
Section: Design Of the Devicementioning
confidence: 99%
“…Enhancing our own insertion process is necessary to reduce at least by half and fully match the resolution achievable on systems produced with common metal deposition processes. 4,[9][10][11]…”
Section: Electrical Behavior Of the Micro-channelsmentioning
confidence: 99%
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