Materials that combine metallic electrical conductivity and high toughness are in great demand for advancing flexible electronics. However, such materials are still lacking. Previously reported flexible materials with metallic conductivity (≥1 × 106 S·m‒1) usually compromise on toughness (<3 MJ·m‒3). Here, a binary metalgel is presented that features a binary metal continuum stabilized by a three‐dimensional polymer network. The binary metal continuum consists of hard metal particles encapsulated by soft liquid metal. The continuous conductive pathways within the polymer network enable a metallic electrical conductivity of 2.50 × 106 S·m‒1. Additionally, the combination of hard metal particles, soft liquid metal, and polymer network facilitates stress transfer throughout the material, creating a triple‐mode energy dissipation mechanism that enhances toughness to 14.40 MJ·m‒3. This strategy offers a valuable framework for developing materials that achieve both superior electrical and mechanical properties.