An X-Band SiGe Single-MMIC Transmit / Receive Module for Radar Applications

Mitchell, Mark A.; Cressler, John D.; Kuo, Wei-Min Lance; Comeau, J.P.; Andrews, J.M.

doi:10.1109/radar.2007.374298

Cited by 9 publications

(4 citation statements)

References 4 publications

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“…It has been shown [1,[3][4][5] that this can be done when the core chip is considered, because the core chip has relatively moderate requirements on noise figure and output power but high requirements on integration, yield, and digital content. It has been shown [1,[3][4][5] that this can be done when the core chip is considered, because the core chip has relatively moderate requirements on noise figure and output power but high requirements on integration, yield, and digital content.…”

Section: V M M I C T E C H N O L O G Ymentioning

confidence: 99%

“…As shown above the cost impact of ICs becomes more pronounced when a low-cost, high-volume approach is used for the TRM, which makes it desirable to use low-cost semiconductor technologies where possible. It has been shown [1, 3–5] that this can be done when the core chip is considered, because the core chip has relatively moderate requirements on noise figure and output power but high requirements on integration, yield, and digital content. This, together with cost, makes the strongest argument in favor of silicon germanium when compared to other semiconductor technologies.…”

Section: Mmic Technologymentioning

confidence: 99%

“…GaAs and GaN, can be chosen for LNA and High power amplifier (HPA), thereby optimizing the overall noise figure and power added efficiency. This has been considered for phased array radar applications for some time [1–5].

Fig.…”

Section: Introductionmentioning

confidence: 99%

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Low-cost TRM technologies for phased array radars

Berg

Thiesies

Billström

2009

Int. J. Microw. Wireless Technol.

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ha • kan berg, heiko thiesies and niklas billstro ¤mLow-cost enabling technologies for T/R modules (TRMs) in phased array radars are proposed and analyzed in terms of technology, performance, and cost aspects. Phase and amplitude controlling integrated circuits (ICs) realized in a low-cost standard silicon process are demonstrated. The design of several ICs at the S-, C-, on X-band has shown that silicon germanium is a strong contender for gallium arsenide. This also applies to TRMs suited for military active phased array antenna (AESA) radars. The circuits presented in this paper are manufactured by austriamicrosystems in their 0.35 mm SiGe-BiCMOS process with an f T of around 70 GHz. A TRM packaging concept based on soldered surface-mount technology and organic substrates is also demonstrated. A cost analysis concludes that by using the proposed packaging concept and the SiGe core-chip technology, the TRM production cost can be potentially reduced by 70% compared to traditional ceramic hermetic packaging with core chip in GaAs technology.

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Section: V M M I C T E C H N O L O G Ymentioning

confidence: 99%

Section: Mmic Technologymentioning

confidence: 99%

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Low-cost TRM technologies for phased array radars

Berg

Thiesies

Billström

2009

Int. J. Microw. Wireless Technol.

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“…It has been proven to have microwave performance complying with radar requirements [2] [3]. At the same time it is suitable for digital integration.…”

Section: B Technology Selectionmentioning

confidence: 99%

A high linearity mixed signal down converter IC for C-band radar receivers

Berg

Thiesies

Hertz

et al. 2007

2007 European Microwave Integrated Circuit Conference

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A mixed signal receiver IC for C-band radars is presented. The design work has been focused on spectral purity and miniaturization. Miniaturization is achieved by minimizing peripheral components and control signals using internal calibration data and temperature compensation tables stored in RAM on-chip. This allows for the packaged chip to be used with a minimum of. The chip is manufactured by Austria Microsystems in their 0.35µm SiGe-BiCMOS process and utilizes digital IP-block included in the design kit.

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