“…These include direct real-time methods (multiple spark high-speed photography [11], pulsed laser high-speed photography [12] and holography [13,14], laser shadowing [15], and Rayleigh wave photography [15][16][17], direct post-mortem techniques (Wallner line fractography [ 18,19] and active ultrasonic fractography [20][21][22], and indirect real-time methods (potential drop [23,24], conductive mesh [25][26][27], and continuous conductive coating [4,28] techniques). These include direct real-time methods (multiple spark high-speed photography [11], pulsed laser high-speed photography [12] and holography [13,14], laser shadowing [15], and Rayleigh wave photography [15][16][17], direct post-mortem techniques (Wallner line fractography [ 18,19] and active ultrasonic fractography [20][21][22], and indirect real-time methods (potential drop [23,24], conductive mesh [25][26][27], and continuous conductive coating [4,28] techniques).…”