Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO

Kadomoto, Junichiro; Hasegawa, So; Kiuchi, Yusuke; Kosuge, Atsutake; Kuroda, Tadahiro

doi:10.1587/transele.e99.c.659

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Transmitter and Receiver Design1

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2020

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“…The first concern is electromagnetic compatibility. [25][26][27][28][29] Especially, regarding electromagnetic interference, the proposed inductive-coupling interposer is not easily affected by external noise thanks to no power supply noise from the H-bridge transmitter and the use of differential AC coupling. The second concern is degradation of communications performance due to misalignment of coupling coils.…”

Section: Transmitter and Receiver Designmentioning

confidence: 99%

2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm², 1.2 pJ/b data-transfer

Shiba

Cheng

Hamada

et al. 2020

Jpn. J. Appl. Phys.

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2.5D integration is achieved using inductive coupling in place of bump connections. The size of the interposer is less than 1/34 that of conventional technology, leading to cost saving without compromising area and energy efficiency. A 40 nm CMOS test chip is fabricated and data-transfer performance of 317 Gb/s/mm2, 1.2 pJ/b is measured. Moreover, it is shown the area and energy efficiency of this technique could be improved more than linearly in accordance with the technology scaling rules.

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Section: Transmitter and Receiver Designmentioning

confidence: 99%

2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm², 1.2 pJ/b data-transfer

Shiba

Cheng

Hamada

et al. 2020

Jpn. J. Appl. Phys.

Self Cite

View full text Add to dashboard Cite

show abstract

Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO

Cited by 1 publication

References 7 publications

2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm², 1.2 pJ/b data-transfer

2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm², 1.2 pJ/b data-transfer

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Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO

Cited by 1 publication

References 7 publications

2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm2, 1.2 pJ/b data-transfer

2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm2, 1.2 pJ/b data-transfer

Contact Info

Product

Resources

About

2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm², 1.2 pJ/b data-transfer

2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm², 1.2 pJ/b data-transfer