Analysis and Evaluation of Thermally Annealed Pyrolytic Graphite Heat Spreader for Power Modules

Molecular dynamics investigation on the interfacial thermal resistance between annealed pyrolytic graphite and copper

“…However, due to its soft texture, APG needs to be wrapped with metallic materials such as copper to enhance its structural stability. Gurpinar et al 8 conducted a study on the heat dissipation of high-power semiconductor modules by using APG instead of copper and found that it can effectively reduce the thermal resistance between the heat source and the cold plate by 50%. Chen et al 9 quantitatively analysed the heat dissipation effect of APG/aluminium alloy in the integrated components.…”