Analysis and Mitigation of Parasitic Mode Conversion for Microstrip to Stripline Transitions

Rimolo-Donadío, Renato; Supper, J.; Winkel, T.-M.; Harrer, H.; Schuster, Christian

doi:10.1109/temc.2011.2182054

Cited by 20 publications

(12 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This is especially troublesome in circuits with large metallization layers on both the front side and the back side, as in circuits that use conductor-backed coplanar waveguides (CPW) or stripline interconnects [1], [4]. Traditionally, most circuits operating above 100 GHz have used conductor-backed CPW interconnects [5].…”

Section: Introductionmentioning

confidence: 99%

Suppression of Parasitic Substrate Modes in Multilayer Integrated Circuits

Eriksson

Gunnarsson

Nilsson

et al. 2015

IEEE Trans. Electromagn. Compat.

View full text Add to dashboard Cite

Integrated circuits (ICs) with multilayer backend process and a large front-side ground plane support the propagation of parasitic substrate modes. These modes resonate at frequencies that typically are within the bandwidth of circuits operating close to and in the submillimeter-wave range, i.e., beyond 300 GHz. The resonances cause unwanted coupling and feedback, which result in circuit instability and degraded performance for circuits operating in the range of these resonances. A common method to suppress these modes from propagating is to use numerous through-wafer vias distributed over the entire circuit. In this letter, we present a study of substrate modes in multilayer ICs with thin-film microstrip interconnects at 125-330 GHz. We show that a doped Si carrier underneath the circuit effectively eliminates the effect of substrate modes on the circuit functionality. This method requires no backside processed through-wafer vias and no backside metallization.Index Terms-Electromagnetic interference, integrated circuit (IC), millimeter wave, parasitic modes, thin-film microstrip lines.

show abstract

Section: Introductionmentioning

confidence: 99%

Suppression of Parasitic Substrate Modes in Multilayer Integrated Circuits

Eriksson

Gunnarsson

Nilsson

et al. 2015

IEEE Trans. Electromagn. Compat.

View full text Add to dashboard Cite

show abstract

“…Considering the AIP, stripline feed network is adopted, although it needs more substrate volume than microstrip structure. Also, parallel plate modes [12] appeared at the operating frequencies, due to stripline structure. Shorting vias are placed around the slot aperture to effectively suppress them.…”

Section: B Aperture Coupled Antenna Designmentioning

confidence: 99%

Dual-band Dual-polarized Antenna for mm-Wave 5G Base Station Antenna Array

Siddiqui

Sonkki

Chen

et al. 2020

2020 14th European Conference on Antennas and Propagation (EuCAP)

View full text Add to dashboard Cite

A dual-band dual-polarized antenna suitable for 5G millimeter-wave base station antenna array is presented in this paper. It operates on all the commercial millimeter wave frequencies allotted in 5G NR from 24.25 GHz up to 40 GHz. The antenna is based on a novel stacked square ring patches arrangement to achieve wide dual band and stable radiation pattern. The antenna offers a sharp roll-off and a filter like response between the operating bands due to the strongly coupled resonators. Antenna design principle and simulated performance are discussed in detail. The-10 dB impedance bandwidth of the lower band starts from 24.25 GHz to 29.5 GHz while the higher band covers the 37 GHz to 40 GHz. The realized gain remains stable between 5 to 6 dBi at all the operating frequencies. The isolation between the ports and cross-polar discrimination remain better than 20 dB in all the covered frequency range.

show abstract

“…Ground via1, via2 and via3 are also used for the impedance matching at high frequency, and the relative position to the signal strip should be optimized according to the taper size. Ground via2 at proper position near the trace can inhibit the excitation of parallel-plates mode which is characterized as a semi-cylindrical wave [12]. And the crosssectional E-field of the transition is shown in Fig.…”

Section: Transition Configuration and Designmentioning

confidence: 99%

A Novel Transition From Substrate Integrated Suspended Line to Conductor Backed CPW

Yan

et al. 2016

IEEE Microw. Wireless Compon. Lett.

View full text Add to dashboard Cite

A novel transition from substrate integrated suspended line (SISL) to conductor backed coplanar waveguide (CBCPW) is proposed in this letter. The proposed transition utilizing the standard PCB techniques eliminates the drawbacks of the traditional suspended circuits and integrates the suspended circuits effectively. The new transition is a self-packaged system verified by both simulation and experiment results. Back-to-back transition structure has insertion loss of less than 0.6 dB and return loss of better than 15 dB from dc to 8 GHz.Index Terms-Conductor backed coplanar waveguide (CBCPW), printed circuit board (PCB), substrate integrated suspended line (SISL), transition.

show abstract

Analysis and Mitigation of Parasitic Mode Conversion for Microstrip to Stripline Transitions

Cited by 20 publications

References 7 publications

Suppression of Parasitic Substrate Modes in Multilayer Integrated Circuits

Suppression of Parasitic Substrate Modes in Multilayer Integrated Circuits

Dual-band Dual-polarized Antenna for mm-Wave 5G Base Station Antenna Array

A Novel Transition From Substrate Integrated Suspended Line to Conductor Backed CPW

Contact Info

Product

Resources

About