2001
DOI: 10.1080/08827510213500
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Analysis and Simulation of Functional Stress Degradation on VDOMS Power Transistors

Abstract: The use of VDMOS transistor under certain functional stress conditions produces a modification of its physical and electrical properties. This paper explores the physical analysis and SPICE simulation of the degradation effects related to the component micronic structure, and points out the degraded parameters following this stress.

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Cited by 3 publications
(6 citation statements)
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“…It appears that the value V max ¼ 76; 000 cm 2 =V s before stress is being reduced after stress to a value of 52,000 cm 2 /V s (Figure 5). This does confirm the analysis done which relates the characteristics of degradation to the problem of the mobility modulation inside the channel (Zoaeter et al, 2002). Gate charge test.…”
Section: Functional Stress In Vdmossupporting
confidence: 78%
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“…It appears that the value V max ¼ 76; 000 cm 2 =V s before stress is being reduced after stress to a value of 52,000 cm 2 /V s (Figure 5). This does confirm the analysis done which relates the characteristics of degradation to the problem of the mobility modulation inside the channel (Zoaeter et al, 2002). Gate charge test.…”
Section: Functional Stress In Vdmossupporting
confidence: 78%
“…In order to obtain the functional stress conditions, we have designed an experimental device to simulate the "normal" conditions of the coercive use of the VDMOS within an inverter circuit (Zoaeter et al, 2002) (Figure 2). The control circuit permits variation of the frequency, the cyclic ratio and the amount of the gate driving-voltage.…”
Section: Experimental and Simulation Detailsmentioning
confidence: 99%
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“…This step should allow us to correlate ageing to any model parameter drift, or even to help identify a degradation phenomenon [6]. A commercial Motorola RF LDMOS has been used for this study.…”
Section: Device Experimental Characterizationmentioning
confidence: 99%