2019
DOI: 10.1016/j.aeue.2018.12.006
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Analysis of AlGaN/GaN HEMT using discrete field plate technique for high power and high frequency applications

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Cited by 73 publications
(17 citation statements)
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“…Recently, researchers have shown immense interest in nitride semiconductors for application in high-power and emitting devices, considering that the use of GaN-based semiconductors has met great success in industry. However, the Al x Ga y In 1– x – y N semiconductor system presents several limitations, including the high cost of the elements, particularly indium, the segregation of indium in the devices, and a weak green-light emission intensity. …”
Section: Introductionmentioning
confidence: 99%
“…Recently, researchers have shown immense interest in nitride semiconductors for application in high-power and emitting devices, considering that the use of GaN-based semiconductors has met great success in industry. However, the Al x Ga y In 1– x – y N semiconductor system presents several limitations, including the high cost of the elements, particularly indium, the segregation of indium in the devices, and a weak green-light emission intensity. …”
Section: Introductionmentioning
confidence: 99%
“…Figure10shows the comparison of J-FOM (= fT × BVgd) as a function of the gate length for various GaN-based HEMTs[20,21,[29][30][31][32][33][34][35][36][37][38][39][40][41][42][43]. The MIS-HEMTs that were fabricated in this study exhibited the J-FOM in the range between 5.57 and 10.67 THz•V, which are the state-of-the-art values reported for GaN-based HEMTs.…”
mentioning
confidence: 70%
“…As a result, it supplies C GS and C GD , where C GS is known by gate to source capacitance, and C GD is defined by gate to drain capacitance 47 . The parasitic capacitance under the gate terminal is kept to a minimum due to its lower size and smaller field plate area 48 45,49 .…”
Section: Resultsmentioning
confidence: 99%