Analysis of Heat Transfer from a Heat Dissipating Device on a Substrate

Silveira, Joao Vitor Thomsen; Li, Zidi; Yang, Bolun; Yasui, Ryuta; Shinoda, Takeshi; Fushinobu, Kazuyoshi

doi:10.1109/itherm.2019.8756498

Cited by 1 publication

(1 citation statement)

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“…However, as the speed and I/O count of high-power packages increase, thermal dissipation control and management poses a critical concern [ 5 , 6 , 7 ]. Most of the heat generated by the chip is transferred to the printed circuit board (PCB) [ 8 ]. FCBGAs are commonly attached to a metal cavity heat spreader through a thermal interface material (TIM) to extend the heat conduction area of the die and further improve the heat dissipation (see Figure 1 b).…”

Section: Introductionmentioning

confidence: 99%

Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

et al. 2023

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Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packages is often improved through the use of an external heat sink. However, the heat sink increases the solder joint inelastic strain energy density, and thus reduces the board-level thermal cycling test reliability. The present study constructs a three-dimensional (3D) numerical model to investigate the solder joint reliability of a lidless on-board FCBGA package with heat sink effects under thermal cycling testing, in accordance with JEDEC standard test condition G (a thermal range of −40 to 125 °C and a dwell/ramp time of 15/15 min). The validity of the numerical model is confirmed by comparing the predicted warpage of the FCBGA package with the experimental measurements obtained using a shadow moiré system. The effects of the heat sink and loading distance on the solder joint reliability performance are then examined. It is shown that the addition of the heat sink and a longer loading distance increase the solder ball creep strain energy density (CSED) and degrade the package reliability performance accordingly.

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