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A new heat dissipation measurement method based on an external heater and a heat flux sensor was proposed. The information of boundary conditions and thermal properties of materials, such as the thermophysical properties of printed circuit board (PCB), in the heat transfer path is not necessary for heat dissipation measurement in the proposed method.Numerical and experimental study was carried out on testing board with single component to estimate the feasibility of this method, in addition, the effects of the thermal resistance between heater and die/chip on the relative error of the proposed measurement method are investigated. This method is proved to be able to predict the heat dissipation from a single electronic component accurately, and has high applicable for the single BGA component.

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