Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits

HiPIMS obtained carbon nano-coatings on copper foil and their thermal conductivity

“…It is well accepted that the thermal transport in carbon materials is dominated by phonons, even for graphene; the strong covalent sp 2 bonding can, therefore, generate efficient thermal transport by lattice vibrations [5]. Owing to the perfect 2D structure of monolayer graphene in nature, the heat can transport along the graphene in-plane direction by the phonons resulting in the superior thermal conductivity over 5000 W/mK [8].…”

“…In fact, it is stated in [3] that the lifetime of a transistor would be extended by one order of magnitude if hotspot temperatures are reduced by 20 • C. In view of the abovementioned reasons, it has become essential to solve the problem of (nonuniform) heat dissipation for the progression of the electronics industry toward next generation integrated circuits and 3D electronics. To achieve this, new materials and/or materials systems are required that conduct heat quickly and stably [4][5][6]. Although copper and artificial graphite sheet are the most common heat spreading elements used in today's semiconductor industry and consumer electronics, modern industry is pursuing an increasing demand for better heat conductive materials at a level beyond these two.…”

Optimized method for thermal through silicon via placement with non-uniform heat sources in 3-D-IC

“…The application of a stacked three-dimensional integrated circuit(3D-IC) has offered significant improvements in the system integration and packaging density, but the overheated hot spot problem remains a key issue in chip manufacturing and operation [1,2]. The technology of 3D-IC based on through-silicon vias (TSVs) can effectively and quickly facilitate heat transfer and reduce the power consumption of chips [3]. Thermal management is considered as an extremely complex challenge in 3D-IC development [4].…”

An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

“…The accurate determination of temperature distributions is an important problem in multiscale semiconductor structures subjected to heat sources [73]. The implementation of the BEM presents a further challenge when solving heat transfer problems with distributed heat sources, because domain integrals arise in the resulting integral equations alongside the normal boundary integrals.…”