1997
DOI: 10.1063/1.118647
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Analysis of In0.07Ga0.93As layers on GaAs compliant substrates by double crystal x-ray diffraction

Abstract: Double crystal x-ray diffraction data is presented from the most extensive compliant substrate experiment to date. Five consecutive InGaAs–GaAs growths were performed simultaneously on GaAs-based thin film compliant substrates and thick reference substrates. The In0.07Ga0.93As layers were grown to thicknesses below and above the conventional critical thickness. It was found that InGaAs films grown on the compliant substrates have a larger critical thickness and slower strain relief than InGaAs grown on convent… Show more

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Cited by 39 publications
(20 citation statements)
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“…Two possible sources of the high discrepancy between the expected and measured values are: 1) scattering and depolarization losses [22] due to this surface roughness, which were not taken into account during simulations that assume planar boundaries between layers, and 2) possible misfit dislocations in the lattice-mismatched absorber. For a similar In concentration, the critical thickness of InGaAs is reported to be 2000 A [23]. Also, visual inspection of the wafer and measured low dark current indicate good crystalline quality.…”
Section: Resultsmentioning
confidence: 76%
“…Two possible sources of the high discrepancy between the expected and measured values are: 1) scattering and depolarization losses [22] due to this surface roughness, which were not taken into account during simulations that assume planar boundaries between layers, and 2) possible misfit dislocations in the lattice-mismatched absorber. For a similar In concentration, the critical thickness of InGaAs is reported to be 2000 A [23]. Also, visual inspection of the wafer and measured low dark current indicate good crystalline quality.…”
Section: Resultsmentioning
confidence: 76%
“…(129)(130)(131) Rather than using a rigid substrate, which produces stress in the growing film, one employs a thin-film substrate that is able to deform to match the lattice constant of the film. One way to obtain such a substrate takes advantage of the different chemical reactivities of GaAs and AlAs.…”
Section: Strained-layer Epitaxymentioning
confidence: 99%
“…5 For applications involving electrical devices this anneal temperature is too high to maintain the designed dopant profiles or the integrity of deposited metal interconnect layers. Thermocompression bonding with Au and Al metal layers has been investigated as a means to obtain strong bonding without the requirement of high temperature anneals.…”
Section: Technical Reportmentioning
confidence: 99%