Analysis of Ohmic Losses Due to Solder and Pressure Interconnection and Related Interface Resistances for Solar Cells

Urban, Tobias; Heimann, Matthias; Schmid, Alexander; Mette, A.; Heitmann, Johannes

doi:10.1016/j.egypro.2015.07.059

Cited by 12 publications

(4 citation statements)

References 7 publications

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“…The pronunciation of these ripples reaches a limit at 100 cycles. These observations match those of Urban et al, [ 12 ] who performed electrical measurements on the backside to determine contact resistances for the press contacts and solder contacts before and after TC tests. As these observations were made for all modules investigated so far, it can be concluded that a pure press contact is not sufficient for proper electrical contacting from solder ribbon to cell, which contradicts the result of Dupuis et al [ 13 ] 2) After 50 cycles, nearly all soldered rear‐side pads are visible except pads, which are not successfully soldered during production.…”

Section: Rear‐side Pad Solderingsupporting

confidence: 86%

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Evaluation of the Quality of Solder Joints within Silicon Solar Modules Using Magnetic Field Imaging

Kaufmann¹,

Lausch²,

Lin³

et al. 2021

Physica Status Solidi (a)

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Solar cells and modules are already a mature technology in mass production. It is critical to optimize and to systematically monitor their performance. The introduction of automated soldering processes and the increasing usage of novel contacting schemes can cause harmful defects, e.g., missing and defective contacts, and, thus, affect the electrical performance of solar modules after production or in field usages. Herein, magnetic field imaging (MFI) is utilized to do a non‐destructive, quantitative analysis of the modules to investigate the quality of the soldering contacts. In detail, the cross connector, interconnector, and rear‐side pads are investigated. The typical in‐field observed defects are presented. For the first time, the quality of rear‐side pads under operation is studied in detail. It is shown that 1) directly after production, the current conduction takes place not only via the rear pads but also via the press‐on contact between the bare aluminum and the rear‐side ribbons; 2) an off‐centered ribbon on the pad leads to abnormal current distribution; and 3) single rear‐side pad breaks as a function of thermal cycles due to thermo‐mechanical stress.

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Section: Rear‐side Pad Solderingsupporting

confidence: 86%

“…In sum, however, a clear trend can be observed over several modules. With increasing thermal cycles, the amount of electrical conducting rear‐side pads decreases as it was also stated by Urban et al [ 12 ]…”

Section: Rear‐side Pad Solderingmentioning

confidence: 53%

Evaluation of the Quality of Solder Joints within Silicon Solar Modules Using Magnetic Field Imaging

Kaufmann¹,

Lausch²,

Lin³

et al. 2021

Physica Status Solidi (a)

View full text Add to dashboard Cite

show abstract

“…However, meeting this requirement results in the emergence of other issues. Specifically, the much greater contact resistance between rear Ag and Al electrodes often becomes a critical problem, impairing cell efficiency [2,3].…”

Section: Introductionmentioning

confidence: 99%

“…In this case, the key role of the glass frit involved and the relevant mechanism of the current transmission through the Ag/Si contact have been extensively studied [6][7][8]. However, in the rear-side metallization of PERC solar cells, the Ag/Si non-contact Ag paste is employed to form a Si/Al/Ag interconnection for current transmission [2,3]. So far, little attention has been paid to the influence of the glass frit in Ag paste on the contact resistance between the Ag and Al electrode.…”

Section: Introductionmentioning

confidence: 99%

Influence of Glass Phase in Silver Paste on Metallized Contact Resistance between Rear Silver and Aluminum Electrodes of Crystalline Silicon PERC Cells

Zhang¹,

Li²,

Tong³

et al. 2019

Applied Sciences

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In the back-side metallization process of the passivated emitter and rear cell (PERC), the contact between the Ag rear electrode and Al rear electrode is an important factor for cell efficiency. In this paper, we report on the effect of Ag paste containing two types of oxide glass frit, V-B-Te and Pb-B-Si, on the Ag/Al contact, owing to their remarkable contrast with regard to the Ag/Al contact resistance. By combining the observation of the Ag/Al interface structure with the investigation on the interaction between glass and Al, glass transition temperature, and the distribution of glass phase in the Ag electrode, the influence of the glass phase on the contact resistance between rear Ag and Al electrodes was clearly elucidated.

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Insight into the Contact Mechanism of Ag/Al–Si Interface for the Front‐Side Metallization of TOPCon Silicon Solar Cells

Li,

Zhou,

Chen

et al. 2024

Small Methods

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For N‐type tunnel‐oxide‐passivated‐contact silicon solar cells, optimal Ag/Al–Si contact interface is crucial to improve the efficiency. However, the specific roles of Ag and Al at the interface have not been clearly elucidated. Hence, this work delves into the sintering process of Ag/Al paste and examines the impact of the Ag/Al–Si interface structure on contact quality. By incorporating TeO2 into PbO‐based Ag/Al paste, the Ag/Al–Si interface structure can be modulated. It can be found that TeO2 accelerates the sintering of Ag powder and increases Ag colloids within glass layer, while it simultaneously impedes the diffusion of molten Al. It leads to a reduced Al content near the Ag/Al–Si interface and a shorter diffusion distance of Al into Si. Notably, it can be demonstrated that the diffusion of Al in Si layer is more effective to reduce the contact resistance than the precipitation of Ag colloids. Therefore, the PbO‐based Ag/Al paste, which favors Al diffusion, leads to solar cells with lower contact resistance and series resistance, higher fill factor, and superior photoelectric conversion efficiency. In brief, this work is significant for optimizing metallization of silicon solar cells and other semiconductor devices.

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Analysis of Ohmic Losses Due to Solder and Pressure Interconnection and Related Interface Resistances for Solar Cells

Cited by 12 publications

References 7 publications

Evaluation of the Quality of Solder Joints within Silicon Solar Modules Using Magnetic Field Imaging

Evaluation of the Quality of Solder Joints within Silicon Solar Modules Using Magnetic Field Imaging

Influence of Glass Phase in Silver Paste on Metallized Contact Resistance between Rear Silver and Aluminum Electrodes of Crystalline Silicon PERC Cells

Insight into the Contact Mechanism of Ag/Al–Si Interface for the Front‐Side Metallization of TOPCon Silicon Solar Cells

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