Physical
vapor deposition of metal contacts onto thin film organic
functional materials is widely used in organic electronic technologies.
Using the oligothiophenes (OTs) α-sexithiophene (α-6T)
and 2,2′:5′2″-terthiophene (3T) as models for
thiophene-containing functional organic films, the metal/organic interface
chemistry, metal penetration and reaction depths, and surface metallization
processes are investigated and compared for Ag, Al, Mg, and Ca contacts
using Raman and X-ray photoelectron spectroscopies. Ag shows only
modest penetration, with some surface metallization but no reaction
chemistry on OTs. Al and Ca induce some OTs reaction but exhibit the
least propensity to penetrate these films with the greatest ability
to metallize on the surface. In contrast, Mg exhibits complete penetration
of 5 ML OT films with no reaction chemistry or surface metallization.
On 50 ML OT films, however, Mg still exhibits the greatest depth of
penetration with no surface metallization but does induce a small
amount of reaction chemistry initiated by electron transfer from Mg
to the OT film. These results reveal significant differences in the
depth to which the deposited metal chemically impacts OT thin films
during physical vapor deposition and reinforce the critical role of
interface chemistry on the performance of organic electronic devices
formed with such materials.