“…The current-voltage-temperature (I-V-T) and capacitance-voltage-temperature (C-V-T) characteristics of these devices have been extensively studied and reported in the literature for more than four decades because of simplicity in the fabrication [12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29][30]. In these devices, different current-transport mechanisms may dominate the others at a certain temperature and voltage regions, such as thermionic emission (TE), thermionicfield emission (TFE), field emission (FE), recombination tunneling via interface states or dislocations, minority carrier injection, recombination and multi-step tunneling.…”