2016
DOI: 10.7567/jjap.55.112101
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Analysis of the light-extraction efficiency of SiC substrate-based flip-chip vertical light-emitting diodes with embedded photonic crystals

Abstract: To improve the light-extraction efficiency (LEE) of flip-chip vertical light-emitting diodes (LEDs) grown on silicon carbide (SiC) substrate, embedded photonic crystals (PhCs) were alternatively introduced into the n-GaN layer of LEDs, since etching of the SiC substrate was very difficult. The finite-difference time-domain (FDTD) method was employed to investigate the combination effects of the micro-cavity and the embedded PhCs. The influences of the PhCs configurations on the LEE of LEDs were also examined t… Show more

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Cited by 3 publications
(3 citation statements)
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“…The LEE of the LED was greatly improved thanks to the alternating introductions of embedded PC structures that were scattered across the n-GaN layer. 114 The structure is schematically shown in Figure 36A. It can be seen in Figure 32B-D that a 20% LEE enhancement was accomplished by determining the optimal parameters of the PC.…”
Section: 22mentioning
confidence: 99%
See 1 more Smart Citation
“…The LEE of the LED was greatly improved thanks to the alternating introductions of embedded PC structures that were scattered across the n-GaN layer. 114 The structure is schematically shown in Figure 36A. It can be seen in Figure 32B-D that a 20% LEE enhancement was accomplished by determining the optimal parameters of the PC.…”
Section: 22mentioning
confidence: 99%
“…conducted research and design work on a vertical chip LED that was produced on a substrate made of SiC. The LEE of the LED was greatly improved thanks to the alternating introductions of embedded PC structures that were scattered across the n‐GaN layer 114 . The structure is schematically shown in Figure 36A.…”
Section: Different Phc Structures To Improve the Optoelectronic Perfo...mentioning
confidence: 99%
“…Silicon carbide (SiC) is an extremely useful semiconductor material which has already found applications in light-emitting diodes (LEDs) [1], detectors [2], and power devices [3] that operate at high temperatures and/or high voltages. SiC is also an excellent substrate for growing GaN-based materials [4] and, most importantly, for preparing wafer-scale epitaxial graphene using the high-temperature sublimation technique [5]. Therefore, it is possible to prepare not only low-dimensional graphene-based electronic devices [5] but also high-power devices [3], LEDs [1], and GaN-based high-electron mobility transistors (HEMTs) [6] on the same SiC substrate.…”
Section: Introductionmentioning
confidence: 99%