Analysis of Thermal Performance of High Power Light Emitting Diodes Package

Chi, Wei-Hao; Chou, Tsung-Lin; Han, Cheng-Nan; Chiang, Kuo‐Ning

doi:10.1109/eptc.2008.4763488

Cited by 25 publications

(17 citation statements)

References 8 publications

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“…The temperature of the chips is the highest, about 81 ℃, and that of the plastic is the lowest, about 68 ℃. Comparing with the LEDs package with a single chip [9] , the heat issue caused by stacking and coupling of the heat in multi-chips is more serious. The temperature of the corner near the center of each chip is higher, and that of each chip away from the center is lower.…”

Section: Results and Analysismentioning

confidence: 99%

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Thermal performance analysis of LED with multichips

Han

Guo

Zhang

et al. 2011

J. Wuhan Univ. Technol.-Mat. Sci. Edit.

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The package and system level temperature and thermal stress distributions of 10 W light emitting diode (LED) with 4 chips and 100 W LED with 100 chips were investigated using finite element analysis. The chips were arranged on a Si sheet which is soldered on the copper/diamond composite slug with very high conductivity. The experimental results show that the maximal temperature appears in the chips of both two high power LEDs packages. Compared with the 10 W LEDs package with 4 chips array, the heat issue caused by stacking and coupling of the heat in 100 W LEDs package with 100 chips array is more serious. The chip temperature in the center of the array is much higher, and it decreases with the distance between the chip and the center of LEDs increases. Great thermal stress lies between the chips and the solder, which will reduce the reliability of the package.

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Section: Results and Analysismentioning

confidence: 99%

“…There are several reports on thermal analysis of LEDs package with a single chip, while there is little report on that of LEDs package with multi-chips [9,10] . In this paper, thermal performance analysis of LEDs with four chips array and a hundred chips array were researched.…”

Section: Introductionmentioning

confidence: 99%

Thermal performance analysis of LED with multichips

Han

Guo

Zhang

et al. 2011

J. Wuhan Univ. Technol.-Mat. Sci. Edit.

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“…To solve convection cooling, the LED model is added to the formula of the heat convection coefficient and thus solved the thermal effect [14,15]: …”

Section: Formulation Of Heat Transfer Coefficient H Cmentioning

confidence: 99%

“…This structure improves on LED thermal cooling models by incorporating materials with high heat conductivity, a heat sink, and a forced cooling fan and by reducing T j temperature to meet standard lighting requirements [13][14][15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Effect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode

Hsu

Huang

2014

J Therm Anal Calorim

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In this study, two models are investigated:(1) the convection cooling of high-power indium-galliumnitride light-emitting diodes (LEDs) and (2) the effects of thermal stress distribution. The first model chip (model A) has power of 1 and 3 W and dimensions of 1 mm 9 1 mm 9 0.005 mm, whereas the second model chip (model B) has power of 6 and 10 W and dimensions of 1.8 mm 9 1.8 mm 9 0.005 mm. The results of an analysis of natural convection, forced cooling, and thermal stress are compared with 1, 3, 6, and 10 W thermal specification data. High heat conductivity Al 2 O 3 material used as a printed circuit board (PCB) facilitates the heat conduction and thermal cooling of high-power LEDs and thus increases the strength of the structure. This LED structure model is used in full-scale packaging structures. The wire bonding convection cooling and effect of thermal stress distribution of this packaging design are investigated. We simulate thermal performance and effect of thermal stress distribution of the LEDs using a finite element method with ANSYS software. Heat transfer is coupled with heat conduction, heat convection, and thermal radiation, with the distribution of thermal stress equivalent to that of the von Mises criterion stress. LED is attached to a silicon substrate by wire bonding; the die bond material used is epoxy. LED packaging material is important. If the LED lighting power is fixed, it can increase the convection cooling coefficient, decreases the T j temperature, and the distribution of structural stress. The T j temperature is stable when the heat transfer coefficient had a critical or optimal value. Thermal cooling performance and overall structural strength can be improved when the LED is mounted on the Al 2 O 3 PCB material and heat sink. The models are employed accurately to determine the heat transfer effect, structural strength, life span, performance enhancement, and efficiency.

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“…Recently, with the emergence of high power LEDs, they are received more and more attention, and have begun to play an important role in many applications. Typical applications include back lighting for cell phones and other LCD displays, interior and exterior automotive lighting including headlights, large signs and displays, signals and illumination, traffic lights, spot lights, and so on [1,2].The extensive applications are due to the distinctive advantages towards incandescent lamp and daylight lamp, such as high brightness, small size, ease of integration, anti-mechanical damage, all solid-state, environmental protection, lower power cost, long life, and high efficiency, good reliability, variable color, etc. So, LEDs are called the fourth generation light or green light [3,4], and have been foreseen as an "ultimate lamp" for the future [5].…”

Section: Introductionmentioning

confidence: 99%

A Cooling System with a Fan for Thermal Management of High-Power LEDs

Wang¹,

Li²

2010

JMP

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To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26ºC. Results show that the temperature of the substrate of LEDs reaches 62ºC without the fan, however, it reaches only 32ºC when the best cooling condition appears. The temperature of the LEDs decreases by 30ºC since the heat produced by LEDs is transferred rapidly by the fan. The experiment demonstrates that the cooling system with the fan has good performance.

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Analysis of Thermal Performance of High Power Light Emitting Diodes Package

Cited by 25 publications

References 8 publications

Thermal performance analysis of LED with multichips

Thermal performance analysis of LED with multichips

Effect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode

A Cooling System with a Fan for Thermal Management of High-Power LEDs

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