Thermal performance analysis of LED with multichips

Abstract

The package and system level temperature and thermal stress distributions of 10 W light emitting diode (LED) with 4 chips and 100 W LED with 100 chips were investigated using finite element analysis. The chips were arranged on a Si sheet which is soldered on the copper/diamond composite slug with very high conductivity. The experimental results show that the maximal temperature appears in the chips of both two high power LEDs packages. Compared with the 10 W LEDs package with 4 chips array, the heat issue caused by stacking and coupling of the heat in 100 W LEDs package with 100 chips array is more serious. The chip temperature in the center of the array is much higher, and it decreases with the distance between the chip and the center of LEDs increases. Great thermal stress lies between the chips and the solder, which will reduce the reliability of the package.

Stress Analysis of Ultra-Supercritical and Electrical Three-Way Valve Body Intensity in a High Pressure Heater Using FEM

“…Temperature field. The field variable T(x, y, z, t) of the steady-state temperature field in the three-dimensional Cartesian coordinate system meets the following equation [1,2]:…”

“…The convection boundary meets the following equation [2]: [4]. According to linear thermal stress theory, the thermal stress and mechanical stress are united, which can be expressed as follow:…”

Convection Condition Variation Analysis on Thermal Dissipation of High Power Single Chip LED

“…The progress of high power light emitting diodes (LEDs) as promising potential lighting source for conventional lighting application is evident .This is due to its exceptional characteristics in terms of efficiency, long operating life and reliability which has lead to its application as lighting systems in several areas such as automotive , backlight display, indoor , outdoor, emergency and many more [1]. In spite of that, the high power LEDs are subjected to thermal challenges as heat build up is greater compared to the conventional light source due to it high input power.…”