2009 8th International Conference on Reliability, Maintainability and Safety 2009
DOI: 10.1109/icrms.2009.5270043
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Analysis on failure modes and mechanisms of LED

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Cited by 36 publications
(14 citation statements)
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“…In total, the stress induced by the TC test was the cummulative stress of the Ge and silver glue. When modulus elastic, E of Ge was 103 GPa [13], CTE, α of Ge is 5.9 ppm [11], modulus elastic E of silver filled glue was 6.4 GPa [32], CTE, α of silver glue was 30 ppm [32], T was 100 ∘ C (max TC temperature) and T ref was at 25 ∘ C (room temperature), the normal stress induced on the die, σ was 60.0 MPa. The TC temperature and reference temperature was taken from the jedec standard [16].…”
Section: Impact Of Cracked Ge Substrate To Led Electro-optical Performentioning
confidence: 99%
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“…In total, the stress induced by the TC test was the cummulative stress of the Ge and silver glue. When modulus elastic, E of Ge was 103 GPa [13], CTE, α of Ge is 5.9 ppm [11], modulus elastic E of silver filled glue was 6.4 GPa [32], CTE, α of silver glue was 30 ppm [32], T was 100 ∘ C (max TC temperature) and T ref was at 25 ∘ C (room temperature), the normal stress induced on the die, σ was 60.0 MPa. The TC temperature and reference temperature was taken from the jedec standard [16].…”
Section: Impact Of Cracked Ge Substrate To Led Electro-optical Performentioning
confidence: 99%
“…It was reported that during the LED operation thermo-mechanical stress in the LED will further aggravate the crack, resulting in total failure of the LED [8][9][10]. In a related area of research, Guoguang et al [11] reported in his paper that LEDs which failed during operation were found to have large cracks at the active region.…”
Section: Introductionmentioning
confidence: 99%
“…The fraction of life lost within the th cycle, , is the same for all cycles, and can be written as (8) shown at the bottom of the page. At failure, relationships (6)-(8) yield (9) shown at the bottom of the page, which provides , the number of cycles-to-failure, as (10) Finally, can be inferred trivially from (7).…”
Section: Single-stress Life Models Under Constant and Non-constanmentioning
confidence: 99%
“…The model derived in [3] is improved via an additional experimental campaign consisting mostly of accelerated life tests performed under step-varying forward current, and aiming at more realistic time-to-failure estimates. Indeed, most literature studies about the endurance of LEDs focused on the effect of thermal stress [4]- [6], although also packaging [7] was considered, and different failure modes and mechanisms [8] were analysed. To our knowledge, references like [4]- [8] that tackle the problem of LED degradation and reliability are rare; moreover, forward current is never considered as a stress, and a comparison between constant and non-constant stress applied to LEDs is missing.…”
Section: Introductionmentioning
confidence: 99%
“…Due to the continuous demand for higher lumen output with increasing driving current, the junction temperature of high power LEDs has risen up substantially. It is well known that such a situation would exert a negative effect on the luminous efficacy and long term reliability [1][2][3][4]. In order to enhance the performance of high power LEOs, much work has been done on the development of novel LED packaging [5][6].…”
Section: Introductionmentioning
confidence: 99%