Analytical (&amp;#x201C;mathematical&amp;#x201D;) modeling of the dynamic response of a printed circuit board (PCB) to an impact load

Suhir, Ephraïm

doi:10.1109/icept.2010.5583788

Cited by 3 publications

(2 citation statements)

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“…Suhir [47] developed an analytical model to assess the dynamic reactions of a circuit board designed to be both flexible and heavy, subjected to a large drop load at its supporting contour. The analytical model only considered the fundamental mode of vibration as calculation showed that the first mode contained a majority of the total kinetic energy (81%), which is predicted to be even more Fig.…”

Section: Dynamics Of Drop At Board Levelmentioning

confidence: 99%

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Yau¹,

Hua

2011

Applied Mechanics Reviews

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This article is dedicated to the review of publications on drop impact analysis performed on consumer electronic devices such as cellular phones and two-way radios in the past decade. Prior to the highlights of this review, the scope and motivation behind this work will be briefly explained. A comprehensive survey on published literatures devoted to the methodologies established to analyze the reliability of electronic products exposed to the event of drop impact is presented. The scope of the review is extended beyond product level analysis to also include drop impact study at board level. This type of review is novel and has not been published in the past. The focus will be on the different analytical and numerical modeling approaches and the current status of finite element method in predicting the drop impact performance of electronic devices. Of equal interest is the methodology adopted in past work to establish a correlation between numerical and experimental results. This article serves as a reference to all intended future work which could be an extension from the current known art of drop impact analysis on electronic devices. The time frame of this review is up to year 2010.

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Section: Dynamics Of Drop At Board Levelmentioning

confidence: 99%

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Yau¹,

Hua

2011

Applied Mechanics Reviews

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“…Numerous publications devoted to stresses assessment [1] and mechanical strength control [2] for electronic packages, and in particular to printed circuit boards [3], subjected to bending and shear forces [4] and undergoing dynamic deformations [5], performance of dynamic analysis [6] and reliability [7] using vibration reduction design [8] and vibration suppression methods [9,10] indicate of insufficient strength and reliability of modern electronic packages explored in harsh conditions of variety of impacts including mechanical shocks and vibration. Mathematical modeling and experimental research represented in this paper is aimed at dynamic force analysis of circuit cards in order to eliminate or reduce dynamic stress to an acceptable level and to provide strength and reliability in design of circuit card assemblies subjected to vibration.…”

Section: Introductionmentioning

confidence: 99%

Design of elastic and dissipation joints in bearing structures of electronic packages

et al. 2021

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Mathematical modeling and experimental research represented in this paper is aimed at dynamic force analysis of circuit cards in order to eliminate or reduce dynamic stress and deflection to an acceptable level and to provide strength and reliability in design of circuit card assemblies subjected to vibration. In conditions when viscous friction forces are negligible and viscous friction dampers, such as liquid dampers, cannot be used reduction of oscillation amplitude in critical frequencies was proposed by creating dry friction damper. On the base of mathematical model, the method for reducing dynamic stress and deflection in critical section of circuit cards in resonance conditions has been developed by inserting additional elastic and dissipation joint introduced by dry friction damper. The dry friction damper device is introduced in three variants of design. The effectiveness of dry friction damper is characterized by its elastic and damping characteristics and especially by the stiffness.

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