Analytical approach to evaluate thermal reduction effects of peripheral structures on microwave power GaAs device chips

A Difference Subgridding Method for Solving Multiscale Electro-Thermal Problems

“…With the increase of the integration of the electronic components, Joule heat of the circuits becomes a severe problem; sometimes, it will lead to the decline of the reliability of the circuit [1,2]. In order to solve this problem, the variation of the electromagnetic component parameters with the temperature [1][2][3][4], the distribution of the temperature in the circuit [5][6][7], and the influence of the high temperature on circuit performance [1,2,8] arouse the researchers' study interests to guide circuit design and improve its stability. The difficulty of this study is that the electricity is the cause of the Joule heat, and the heat will affect the electrical parameters in return.…”

“…In the last decades, some algorithms have been further developed and used to study the variation of the circuit's temperature and its effects on the device performance. In 2005, the heat transfer equation was analytically solved to evaluate the changes of temperature and thermal resistance of a microwave power field effect transistor (FET) unit [3]. However, the analytical method is only suitable for solving the electro-thermal problems of some specific structures.…”

Thermal Analysis of Power MMICs Based on Computerization

“…Daewish introduced a novel expression based on the solution of Laplace's equation [4]. Yanagawa developed an analytical approach to evaluate thermal reduction effects of peripheral structures on microwave power GaAs device chips [5]. However they are often impractical, you must follow many assumptions to ensure the accuracy of prediction.…”