2016
DOI: 10.1016/j.compositesb.2016.04.017
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Analytical model for prediction of strength and fracture paths characteristic to randomly oriented strand (ROS) composites

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Cited by 55 publications
(37 citation statements)
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“…All seven batches resulted in FLDs similar to Figure 2.7a. A correlation coefficient, r N , based on the Pearson correlation coefficient, can be calculated to quantify this similarity [38]. Ideally, r N would be the correlation coefficient between the FLD of batch number N and the FLD of the parent population.…”
Section: Measured-orientation Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…All seven batches resulted in FLDs similar to Figure 2.7a. A correlation coefficient, r N , based on the Pearson correlation coefficient, can be calculated to quantify this similarity [38]. Ideally, r N would be the correlation coefficient between the FLD of batch number N and the FLD of the parent population.…”
Section: Measured-orientation Methodsmentioning
confidence: 99%
“…Following the comminution step, the flakes may still be multi-layered. Compression moulding these thick large flakes would result in a staggered platelets system, with short failure paths resulting in low strength [17,21,38]. On top of that, moulding complex shapes with such systems is difficult.…”
Section: Recycling Tpcs By Low-shear Mixingmentioning
confidence: 99%
“…Selezneva et al [27] In addition to the analytical models described above, numerical models for TBDCs have also been developed [28,29]. These models consider either an explicit representation of the fibres/tows [29], or a discrete grid of equivalent laminates with stochastic layups [28], and use Finite Element (FE) simulations of RVEs to cope with the variability in microstructures and the complexity of stress fields.…”
Section: Operatorŝ Normalised Unit Vectormentioning
confidence: 99%
“…Based on optical micrographs taken after tensile failure, several phenomena are typically observed: transverse chip cracking, longitudinal chip splitting, chip debonding, and minor digress of fiber breakage . Selezneva et al claimed that matrix failure is the main cause of failure in tensile tests of carbon/PEEK which occurs in a form of step‐wise delamination between chips. In contrast, the observation of UT‐CTT conducted by Yamashita et al show that fiber breakage, splitting of chips and pulling out of chips are three main failure patterns in tensile fracture.…”
Section: Introductionmentioning
confidence: 99%